p-Electrode Formation by Sputtering

Creating p-electrode by sputtering Palladium (Pd) and Platinum (Pt)

Substrate Polish

Polish away GaN substrate from the back side to be 100 µm thick

Formation of n-Electrode

Sputter Titanium (Ti), Platinum (Pt), and Gold (Au) subsequently to create n-electrode

Dicing

Cut the substrate into each chip