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Piezo-electric Substrate
Electrode Deposition
Photolithography
Dry Etching
RIE-200LC
RIE-200iPC
Electrode Formation
Plasma Cleaning
PC-1100
Photo Resist Removal
RIE-100C
RIE-100iPC
Trimming (1)
Substrate Etching
Plasma CVD
PD-220LC
Trimming (2)
Thin Film Deposition
Insulating Layer Formation
Contact Hole Formation
Etch insulating layer and expose electrode
Dicing
Packaging
Chip Cleaning after Dicing for Wire-bonding
SAW Filter
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