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Compound Semiconductors
GaN Etching for ELO Applications
Mask: SiO2
Etch Rate: 0.3-0.4 um/min.
Chemistry: Chlorine
System Used: SAMCO RIE-200L
GaAs FET
Mask: Photoresist
Etch Rate: >2,000 A/min.
Selectivity: >100
Angle: 90°
GaN Etching for LED applications
Photonics
MEMS
Failure Analysis
Compound SEMI