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Compound Semiconductors

GaN Etching for ELO Applications

Mask: SiO2

Etch Rate: 0.3-0.4 um/min.

Chemistry: Chlorine

System Used: SAMCO RIE-200L

 

 

 

 

GaAs FET

Mask: Photoresist

Etch Rate: >2,000 A/min.

Selectivity: >100

Angle: 90°

GaN Etching for LED applications