New ICP Etching System, Model RIE-140iP

SAMCO has announced the release of a new high-density ICP etching system, which is specifically designed for nano-scale etching of compound semiconductor materials.

Semiconductor lasers use GaN, InGaAsP and require precise etching. SAMCO’s new RIE-140iP system enables precise etching by using an optical end-point detection system. This state-of-the-art system is capable of processing wafers measuring up to 4” in diameter. SAMCO also manufactures a cassette-to-cassette version of this system, the RIE-140iPC, which can process 25-wafer cassettes quickly and efficiently.