SAMCO High Rate Bosch Etching System, Model RIE-800iPB

On May 1, 2006, SAMCO released the high-rate silicon etching system, Model RIE-800iPB, which is targeted specifically for MEMS devices. The etching rate for this system is more than 15 µm/min, nearly five times the etch rate of the standard RIE-200iP system and can be used for wafers up to 8" in diameter.

SAMCO has adopted the "Bosch Process" on license from the German-based company, Robert Bosch, for the silicon etching process technology.

This multiplex etching technology carries out rapid deep silicon etching by alternating repetition of etching and polymer deposition process steps. The RIE-800iPB system uses a newly designed coil along with a 3KW ICP Source RF generator and other system design enhancements for high-rate Bosch Process etching.

SAMCO has established a new laboratory dedicated to MEMS technology, and SAMCO aims to greatly increase market share in the MEMS process equipment market over the next three years. SAMCO also sells other systems for the MEMS market, such as the Model PD-270STP PECVD TEOS deposition system, used for depositing isolation films for via holes and the Model VPE-4F dry isotropic etching system, used for etching sacrificial Si layers with XeF₂ gas.