Liquid Source CVD System

The SAMCO PD-100ST is an affordable R&D system specifically designed to give R&D teams access to SAMCO's patented, high performance 'LS-CVD' technology. LS-CVD features a unique Plasma-Enhanced CVD system utilizing a liquid TEOS source and allowing high-speed deposition of stress-free SiO2 films at temperatures from 80~300°C.
LS-CVD's highly conformal coatings and ability to deposit in high aspect holes is especially suited to TSV and MEMS applications. Furthermore LS-CVD enables the deposition of silicon oxide films with highly controllable internal stress that can be tuned from compressive to tensile. The technology also allows excellent deposition-rate control for the deposition of thin films to thick films (~30 μm).

Applications

• TSV and 3D packaging development
• Highly conformal films for MEMS and other High Aspect Applications
• High-speed deposition of thick silicon oxide films (up to 30 μm)
• Fabrication of optical waveguides
• Fabrication of etch masks for micromachining
• Deposition of films on plastic surfaces
• Low temperature deposition (from ambient to 300°C)

Features

• High deposition rates (>300 nm/min)
• Deposition over large steps (200 μm)
• Deposit in high aspect holes with complete conformity (~25:1)
• Low Particle Levels - A unique reaction chamber design minimizes the generation of particles within the reaction chamber
• Control of Refractive Index - Germanium (Ge), Phosphorus, and Boron liquid source materials can be used to achieve control over the refractive index
• Silane free process minimizes installation and safety costs
• Fully automatic "one-button" operation time with full manual override

Dimensions:

Main Unit: 1340(W) x 1625(D) x 1865(H) mm