Production Type PECVD System (LS-CVD)
The SAMCO PD-330STLC is a 12" (330mm) capable cassette-to-cassette production system utilizing SAMCO's patented, high performance 'LS-CVD' technology. LS-CVD features a unique Plasma-Enhanced CVD technology which utilizes a liquid TEOS source and allows high-speed deposition of stress-free SiO2 films at temperatures from 80~300°C.
The strong sheath electrical field surrounding the cathode-coupled sample stage generates a high level of ion energy, which enables the deposition of silicon oxide films with low internal stress, from thin films to thick films (~30 μm). Furthermore, LS-CVD's films are extremely conformal and the ability to deposit in high aspect holes makes the system especially suited to TSV and MEMS applications.

Applications

• TSV and 3D packaging
• Highly conformal films for MEMS and other high aspect applications
• High-speed deposition of thick silicon oxide films (up to 30 μm)
• Fabrication of optical waveguides
• Fabrication of etch masks for micromachining
• Deposition of films on plastic surfaces
• Low temperature deposition (from ambient to 300°C)

Features

• Process up to 12" wafers (300 mm)
• Can perform batch processing of 3 x 6" wafers
• High deposition rates (>300 nm/min)
• Deposition over large steps (200 μm)
• Deposit in high aspect holes with complete conformity (~25:1)
• Low Particle Levels - A unique reaction chamber design minimizes the generation of particles within the reaction chamber
• Control of Refractive Index - Germanium (Ge), Phosphorus, and Boron liquid source materials can be used to achieve control over the refractive index.
• Multiple handling systems available.