Bench top UV-Ozone Cleaning System
SAMCO's UV-2 is a compact, high-performance, bench top, UV-Ozone Cleaning system. The UV-2 is modular in design and can be configured specifically, upon order, for a number of cleaning, stripping or UV-curing applications. This system is drawer loaded and uses patented technology to uniformly distribute ozone and UV light over the surface of wafers or other substrates. The system employs a programmable logic controller and safety interlocks to protect the operator from hazardous exposure to process ozone and UV light.
This easy to operate system uses a unique combination of ultraviolet radiation, ozone and heat to gently, yet effectively, remove organic materials from a variety of substrates including silicon, gallium arsenide (GaAs), Sapphire, metals, ceramics, quartz and glass.
The versatile UV-2 is well-suited for a variety of applications such as substrate cleaning, photoresist descumming, improving wettability, and UV curing. By operating at atmospheric pressure, the SAMCO UV-2 eliminates the need for a cumbersome, high-maintenance vacuum system. This system is CE marked and UL certified.

Applications

• Removing organic contamination
  
• Pre-clean wafers prior to deposition (e.g. GaAs prior to MBE, sapphire prior to HgCdTe)
• Descumming photoresist and polyimide
• Modifying surfaces for better adhesion
• Final cleaning before wafer bonding
• UV curing
• Growth of thin stable oxide films (Ge, Si)
• Cleaning of AFM tips

Features

• Accommodates a variety of wafer sizes up to 8 inches in diameter
• Compact, uses minimum bench top space
• Heated sample stage increases cleaning/stripping rates
• Broad process temperature range (Ambient to 300°C)
• Completely dry process and will not cause any electrical damage to circuits
• Operates at atmospheric pressure - no vacuum system required
• Drawer interlock system guarantees system is inoperable when drawer is open
• Automatic nitrogen purging system purges the UV-2 chamber after every run
• Built-in ozone catalyst ("ozone killer") unit
• Sealed chamber during process prevents device contamination from atmospheric air

Dimensions:

Main Unit: 610(W) x 572(D) x 426(H) mm