SAMCO ICP Etching Systems

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	RIE-800iPB - High rate Bosch etching system - Processes up to 6" wafers - Recipe storage & data logging - Si deep etching (Bosch capable) - ESC and Helium backside cooling
	RIE-101iPH - R&D type ICP etching system - Manual loading, up to 4" wafers - Manual robot transfer, load-lock - Fluorine & Chlorine compatible - Eelectrostatic Chuck (optional)
	RIE-140iP - Process up to 4" wafers - Low Bias (below 100 V) - Active temperature control - PC based with multi-user and remote access features
	RIE-200iP - Up to 6" wafers (8" optional) - Manual loading, load-lock - ESC and He backside cooling - Recipe storage & data logging - Windows Interface

	RIE-200iPB - Si deep etching (Bosch capable) - Up to 6" wafers (8" optional) - High-speed switching MFCs - Computerized touch panel - ESC and Helium backside cooling
	RIE-200iPC - Production type system - Processes up to 6" wafers - Recipe storage & data logging - Cassette holds 25x 6" wafers - ESC and Helium backside cooling
	RIE-202iPC - Production type ICP System - Process up to 6" wafers - Two process chambers - Cassette holds 25x 6" wafers - ESC and Helium backside cooling
	RIE-10iP - R&D type ICP etching system - Manual loading, up to 4" wafers - Low cost of ownership - Fluorine chemistries only

ICP Etching / DRIE

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