SAMCO Cassette-to-Cassette Production type CVD System, Model PD-220LC, Plasma-Enhanced Chemical Vapor Deposition systems, CVD, Nitride Deposition, Oxide Deposition, DLC Deposition

Products

Home > Products > PECVD Systems > PD-220LC

Plasma-Enhanced CVD System

Model PD-220LC (Cassette-to-Cassette)

SAMCO's PD-220LC is a cassette-to-cassette plasma CVD system for the deposition of passivation layers and interlayer dielectrics on compound semiconductor devices.

The system was designed as a high-volume manufacturing version of the field-proven PD-220N series, and achieves an impressive monthly throughput of ten thousand 2" wafers.

Request more information

Dimensions:

Main Unit: 1250(W) x 2000(D) x 1912(H) mm

Tray cassette

Applications

Deposition of silicon oxide (SiO_x)
Deposition of silicon nitride (SiN)
Deposition of silicon oxy-nitride (SiO_xN_y)
Deposition of amorphous silicon (a-Si:H)

Click here to download information on Properties of SiN film deposition using the SAMCO PD-220LC (388 KB)

Features

Reaction chamber is designed to minimize particle generation and has heated chamber walls
Capable of processing three 4" wafers, five 3" wafers or eight 2" wafers
Tray-based wafer transport reduces handling time and increases throughput
System has a separate cooling chamber
Pump down is performed in the cassette chamber to minimize pump down time in the reaction chamber
High vacuum level prevents contamination and protects devices from oxidation