Plasma Cleaning System, Magazine-to-Magazine production type plasma cleaner, Model SAMCO PXA-100

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Plasma Dry Cleaning System
(Magazine-to-Magazine)

Model PXA-100

The SAMCO PXA-100 is a fully automatic magazine-to-magazine plasma cleaning system that is ideal for the reliability enhancement of surface mount packaging processes.

This versatile system supports a broad range of plasma dry cleaning applications. The system is particularly well suited for plasma cleaning of ball grid array (BGA) substrates prior to wire bonding, which improves final product reliability. Plasma processing of BGA substrates improves the adhesion of molding compound to the substrates and helps prevent die paste bleeds. In addition, plasma post-processing can be used to remove bleeds.

The system is equipped with 1 set of magazine stackers for continuous processing of multiple magazines and high productivity.

High speed leadframe processing is an optional configuration for the PXA-100 that is designed for maximum productivity. This options consists of comb-shaped electrode design to enable processing of 40 leadframes per cycle.

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Dimensions:

Main Unit: 1915(W) x 1085(D) x 1690(H) mm

Applicable Materials:

Package Types: BGA, CSP, COB, etc.

Substrate Dimensions:
Max. 80(W) x 250(D) mm
Min. 20(W) x 130(D) mm

Magazine Dimensions:
Max. 90(W) x 250(D) x 185(H) mm
Min. 25(W) x 150(D) x 100(H) mm

Applications

Molding pretreatment for improved compound adhesion
Prevention and removal of die paste bleeds
Surface cleaning of substrates after laser processing

Features

High throughput of 12 sec./substrate
Magazine stacker unit
Accommodates the full range of substrate types and sizes
Quick conversion between different sizes of substrates and magazines
User-friendly touch panel interface
Supports a broad range of plasma cleaning applications