SAMCO ICP Etching System for R&D Applications, Model RIE-101iPH

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Inductively Coupled Plasma Etching System

Model RIE-101iPH

SAMCO's RIE-101iPH is a manually load-locked type inductively coupled plasma (ICP) etching system. The SAMCO RIE-101iPH is a low-cost, research and development tool, used to anisotropically etch all types of semiconducting, insulating and metallic films.

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Dimensions:

Main Unit: 1130(W) x 1220(D) x 1750(H) mm

Pump Unit: 480(W) x 880(D) x 520(H) mm

Applications

Anisotropic etching of silicon based thin films for ULSI devices
Etching of metal films
Etching of GaAs, InP and other compound semiconductors
Productions of waveguide devices
Fabrication of micromachines

Features

Proprietary Tornado ICP high density plasma source
Capable of processing fluorine and chlorine chemistries
Highly selective anisotropic etching
Optional Electrostatic chuck and Helium backside cooling
Small footprint
Process up to 4" wafers
System interlocks ensure operator and system safety