SAMCO ICP Etching Systems for R&D Applications, Model RIE-10iP

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Inductively Coupled Plasma Etching System

Model RIE-10iP

SAMCO's RIE-10iP is an inductively coupled plasma (ICP) etching system for research and development applications. The system features SAMCO's proprietary Tornado ICP plasma source, which generates a stable high density plasma and enables highly precise anisotropic etching of variety of films such as silicon and silicon oxide.

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Dimensions:

Main Unit: 1380(W) x 640(D) x 1510(H) mm

Pump Unit: 522(W) x 163(D) x 216(H) mm

Applications

Silicon micromachines
Silicon photonic crystal devices
Light wave guides (SiO₂, polyimides)

Features

Proprietary Tornado ICP high density plasma source
Specifically designed for R&D applications that use fluorine gas mixtures
Manual mechanical clamping
Helium backside cooling
Small footprint
Process up to 4" wafers
Multi-step recipe capability