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Inductively Coupled Plasma Etching System

Model RIE-140iP

SAMCO's RIE-140iP is a single wafer ICP etching system especially designed for compound semiconductor materials. This system features SAMCO's latest ICP plasma source technology which generates stable high-density plasma under low pressures and ensures precise anisotropic etching of GaN, InGaAs and quaternary compound semiconductor materials.

 

A cassette-to-cassette version of this system is also available which is equipped with a vacuum cassette chamber for high volume manufacturing. This is Model RIE-140iPC.

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Dimensions:

Main Unit: 880(W) x 1420(D) x 1736(H) mm

Applications

  • Fabrication of laser diodes
  • Photonic crystal devices
  • Quantum dot devices

Features

  • Single wafer processing for up to 4" round wafers
  • Low bias (below 100V)
  • Active temperature control of sample stage and inner wall of the reaction chamber
  • Turbo molecular pump for the load lock chamber
  • Compact footprint
  • Interferometric endpoint detection system (optional)