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Inductively Coupled Plasma Etching System
Model RIE-140iP |
SAMCO's RIE-140iP is a single wafer ICP etching system especially
designed for compound semiconductor materials. This system features
SAMCO's latest ICP plasma source technology which generates stable
high-density plasma under low pressures and ensures precise
anisotropic etching of GaN, InGaAs and quaternary compound
semiconductor materials.
A cassette-to-cassette version of this system is also available
which is equipped with a vacuum cassette chamber for high volume
manufacturing. This is
Model RIE-140iPC.
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Dimensions:
Main Unit: 880(W) x 1420(D) x 1736(H)
mm
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