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Reactive Ion Etching System

Model RIE-2000SQ

SAMCO's RIE-2000SQ is a magazine-to-magazine plasma dry etching system that enables processing of a wide range of materials from large single substrates (200 x 220mm) to batches of small parts.

This system is designed for automated etching of electronic components such as thermal heads and sensors as well as various types of passivation films (silicon compounds) and metal films.

 

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Applications

  • Etching of electronic components such as sensors
  • Etching of rectangular substrates such as ceramics
  • Etching of various types of passivation films (Si compounds)

Features

  • Processing of a wide range of materials, from large single substrates (up to 200x220mm) to batches of smaller parts
  • High throughput is achieved with a short wafer handling time
  • The system can run continuously and without operator interface for up to 80 minutes
  • User-friendly operation via a touch panel screen