Inductively Coupled Plasma (ICP) Etching System Model RIE-200iPC (Cassette-to-Cassette)

SAMCO's RIE-200iPC is a cassette-to-cassette ICP etching system for production applications. The system features a proprietary tornado coil electrode design that efficiently generates a stable high-density plasma which ensures high selectivity, superior etching precision and excellent uniformity. The RIE-200iPC is ideal for applications that require high speed deep etching of silicon oxide and compound semiconductor films such as InP, GaN, AlGaAs and GaAs.

 
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Applications

• Low-damage etching of GaN, GaAs, InP for production of electronic and light emitting devices
• Etching of ferroelectric materials for memory devices
• High-speed etching for micromachine production