SAMCO Cassette-to-Cassette Dual Chamber ICP Etching System for Etching Compound Semiconductors

Products

Home > Products > ICP Etching Systems > RIE-202iPC

ICP Etching System for Compound Semiconductors

Model RIE-202iPC (Cassette-to-Cassette)

SAMCO's RIE-202iPC is a cassette-to-cassette ICP etching system designed for compound semiconductor applications. In order to maximize throughput for high volume production, the RIE-202iPC is equipped with a vacuum cassette chamber, two etching chambers and a dual-arm wafer handling robot.

Request more information

Vacuum Cassette Chamber

Applications

Low-damage etching of compound semiconductors
Etching of ferroelectric materials for memory devices
High-speed etching for micromachine production

Features

Two etching chambers and one vacuum cassette chamber
Cassette-to-Cassette production type system
Advanced high density plasma source design enables precise etching with high degree of uniformity and selectivity
Electrostatic chuck for wafer clamping
Processing of multiple wafers possible using the tray cassette
Capacity: Fourteen 205mm trays
Capable of simultaneous processing of nine 2" wafers or five 3" wafers
Data management and recipe management
Dual-arm wafer handling robot