Reactive Ion Etching System, Model RIE-300NR - RIE system for 300mm wafers, Large batch type RIE System

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Reactive Ion Etching System

Model RIE-300NR

SAMCO's RIE-300NR is a high-performance, fully automatic, high precision Reactive Ion Etching system, designed for processing 300mm wafers. A computerized touch panel provides a user-friendly interface for parameter control and recipe storage.

Etching is performed with minimum sidewall deterioration and a high selectivity between materials. The RIE-300NR chamber is equipped with four-directional pumping mechanism that maximizes uniformity.

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Dimensions:

Main Unit: 850(W) x 1680(D) x 1913(H) mm

Pump Unit: 590(W) x 170(D) x 230(H) mm

Applications

Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, SiN, GaAs and Mo
Manufacturing of micromachines
Stripping passivation, SiN and Oxide layers perfectly for semiconductor failure analysis

Features

Process wafers up to 12" in diameter (Twelve 75mm wafers, eight 100mm wafers or three 150mm wafers)
Fully automatic "One-button" operation with full manual override
Highly selective anisotropic etching
Easy to use computerized touch panel for parameter control, recipe entry and storage