Reactive Ion Etching Systems - RIE for Failure Analysis

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	RIE-1C - Bench-top RIE system - Process up to 4" wafers - Low cost of ownership - Failure analysis applications
	RIE-300NR - Fully automated control - Process up to 12" wafers - Multi-step recipe storage - SEMI-S2 Certified
	RIE-200L - Load-lock dry etching system - Processes up to 8" wafers - Small footprint - Multi-step recipe storage
	RIE-200C - Stainless steel chamber - Cassette-to-cassette system - Process up to 8" wafers - Features a dual-arm robot
	RIE-6000 - Large 600mm x 600mm sample stage - batch processing - 5KW RF generator - Up to 4 gas lines (MFC)

	RIE-10NR - Process up to 8" wafers - Windows based system - Multi-step recipe storage - UL Certified
	RIE-100C - Fully automated control - Process up to 8" wafers - Multi-step recipe storage - Production type RIE system
	RIE-500SQL - Etching of large substrates such as flat panel displays - High volume processing - Up to 500mm square substrates
	RIE-2000SQ - Magazine-to-magazine plasma dry etching system - 200x220mm sample stage - High throughput - User friendly via touch panel
	VPE-4F (XeF₂) - Xenon Difluoride Etching System - Etching of silicon sacrificial layers in MEMS - Table-top etching system - Low cost of ownership

ICP Etching / DRIE

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