UV-Ozone Cleaning System Model UV-300

SAMCO's UV-300 uses a combination of ultraviolet radiation and ozone to remove organic materials from a variety of substrates, improve wettability and enhance adhesion. The UV-300 is clean, reliable and simple to operate. Unlike plasma cleaning systems, it does not damage delicate structures or require a complicated, high-maintenance vacuum system. Nor does it use wet chemistry's messy, corrosive or toxic solvents.

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Applications

• Removing organic contamination
  
• Pre-clean wafers prior to deposition/coating
• Ink removal from wafers
• Descumming of photoresist and polyimide
• Surface modification for better adhesion
• Improving lube coverage on magnetic disks
• UV curing
• Growth of thin stable oxide films on silicon and gallium arsenide (e.g. MOS gate oxide)