Reactive Ion Etching (RIE) Systems

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SAMCO’s RIE systems provide solutions to the most difficult etching problems. SAMCO offers an array of RIE systems for etching silicon, metal and compound semiconductor films.

ICP Etching (DRIE) Systems

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High-density plasma etching systems are currently enjoying heightened popularity due to their ability to offer good etch profiles and high etch rates even at low pressure levels. Sources of increased demand for high-density plasma systems include the increasingly small design rules of ULSI devices, the use of GaN and InP for WDM (Wavelength Division Multiplexing) optical communications and platinum electrodes in FeRAM.

Deposition (PECVD) Systems

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SAMCO’s LS-CVD (liquid source CVD) systems provide the cutting edge performance required for the manufacturing of semiconductor and microelectronics devices. Our LS-CVD systems offer superior step coverage, planarity and gap fill characteristics. In addition, these systems achieve a high level of safety by performing deposition at low temperatures and eliminating the use of poisonous and combustible gases.

Plasma Cleaning Systems

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SAMCO’s Plasma cleaning systems provide solutions to the most difficult cleaning problems. SAMCO offers a line of plasma cleaners for removing organic material from various substrate shapes, sizes and materials.

UV-Ozone Cleaning Systems

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SAMCO’s line of UV-Ozone Stripper/Cleaners utilize a combination of ultraviolet light, high concentration ozone and controlled heating to provide effective cleaning and stripping. Cleaning organic contamination, ink dot removal, improving wettability and photoresist ashing are just some of t8e possible applications of UV-Ozone. UV-Ozone is a “soft”, completely dry process that will not electrically damage circuits. The process operates at atmospheric pressure and does not require a cumbersome, high maintenance vacuum system.