Innovation Center of NanoMedicine (iCONM): Professor Kazunori Kataoka
Professor Kazunori Kataoka presents nanomachine-based drug delivery and the vision of “in-body hospitals” at the 2025 Samco Foundation lecture.
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Chairman Osamu Tsuji Awarded Honorary Doctorate by Kyoto Institute of Technology
Samco Chairman Osamu Tsuji received an Honorary Doctorate from Kyoto Institute of Technology in recognition of his contributions to education and research.
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Atomic Layer Etching Control – Intro to ALE Systems
Introducing Samco’s Atomic Layer Etching (ALE) systems, detailing precise low-bias control and fast gas switching for uniform, low-damage etching processes.
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Kyushu Institute of Technology: Professor Akiyoshi Baba
Prof. Akiyoshi Baba shares insights on CMOS/MEMS research and managing Japan’s leading open-access semiconductor facility at Kyutech’s Iizuka Campus.
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University of Adelaide to Install RIE-400iP-ALE as Australia’s First ALE System
Samco’s RIE-400iP-ALE will become Australia’s first Atomic Layer Etching system, advancing III-V semiconductor and photonics research at the University of Adelaide.
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Invited Lecture at IIT Delhi Delivered by Samco Inc. Founder Osamu Tsuji
Samco founder Osamu Tsuji delivered an invited lecture at IIT Delhi on Plasma CVD, ALD, and the future of thin film technologies in semiconductor research.
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Samco Inc. Completes Construction of New Advanced Technology Development Center
Samco opens its new Advanced Technology Development Center in Kyoto, featuring a Class 1,000 cleanroom to drive next-gen semiconductor innovation.
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TOWA and Samco Successfully Host “Kyoto Day” Technical Seminar in New Delhi
TOWA and Samco co-hosted Kyoto Day in New Delhi, sharing Japan’s semiconductor innovations to support India’s growing semiconductor industry.
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TOWA and Samco to Host “Kyoto Day” in New Delhi Ahead of SEMICON India 2025
Kyoto Day in New Delhi brings TOWA and Samco together to showcase semiconductor innovations ahead of SEMICON India 2025.
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Simultaneous Double-sided Wafer Deposition via Plasma Enhanced ALD
Report investigating simultaneous dual-surface deposition of AlOx films on silicon wafers using the Plasma Enhanced Atomic Layer Deposition (PEALD) technique.
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