Stable Device Isolation Processing for 6-Inch GaN-Based Power Devices
GaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.
DetailsGaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.
DetailsProfessor Kazunori Kataoka presents nanomachine-based drug delivery and the vision of “in-body hospitals” at the 2025 Samco Foundation lecture.
DetailsSamco Chairman Osamu Tsuji received an Honorary Doctorate from Kyoto Institute of Technology in recognition of his contributions to education and research.
DetailsIntroducing Samco’s Atomic Layer Etching (ALE) systems, detailing precise low-bias control and fast gas switching for uniform, low-damage etching processes.
DetailsProf. Akiyoshi Baba shares insights on CMOS/MEMS research and managing Japan’s leading open-access semiconductor facility at Kyutech’s Iizuka Campus.
DetailsSamco’s RIE-400iP-ALE will become Australia’s first Atomic Layer Etching system, advancing III-V semiconductor and photonics research at the University of Adelaide.
DetailsSamco founder Osamu Tsuji delivered an invited lecture at IIT Delhi on Plasma CVD, ALD, and the future of thin film technologies in semiconductor research.
DetailsSamco signs an MoU with IIT Delhi to expand academic and research collaboration, supporting technology exchange and joint initiatives in advanced engineering.
DetailsSamco opens its new Advanced Technology Development Center in Kyoto, featuring a Class 1,000 cleanroom to drive next-gen semiconductor innovation.
DetailsTOWA and Samco co-hosted Kyoto Day in New Delhi, sharing Japan’s semiconductor innovations to support India’s growing semiconductor industry.
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