Category: 2011 Customer
Scientific Paper on Photonic Crystal Laser Fabrication Using InP Plasma Etching by Yokohama National University
Photonic Crystal Point-Shift Nanolasers With and Without Nanoslots—Design, Fabrication, Lasing, and Sensing Characteristics
Shota Kita, Kengo Nozaki, Shoji Hachuda, Hideki Watanabe, Yuji Saito, Shota Otsuka, Takeharu Nakada, Yoshiki Arita, and Toshihiko Baba
Department of Electrical and Computer Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan
IEEE Journal of Selected Topics in Quantum Electronics, (2011) 17, 6
SAMCO ICP Etch System was used for recipe optimization of InP plasma etching. InP etch profile with a high aspect-ratio was successfully fabricated.
For our process capabilities of InP plasma etching, please visit the page below.
InP Dry Etching Process (RIE or ICP-RIE)
Scientific Paper on Nano-pillar Array Formation Using Silicon Plasma Etching by National Taiwan University
Periodic Si nanopillar arrays by anodic aluminum oxide template and catalytic etching for broadband and omnidirectional light harvesting
Hsin-Ping Wang1, Kun-Tong Tsai1,2, Kun-Yu Lai1, Tzu-Chiao Wei1, Yuh-Lin Wang2 and Jr-Hau He1
1Institute of Photonics and Optoelectronics, & Department of Electrical Engineering, National Taiwan University,
Taipei 10617, Taiwan
2Institute of Atomic and Molecular Sciences, Academia Sinica, Taipei, Taiwan
Optics Express (2012) 20,S1, pp. A94-A103
Samco RIE etcher was used for silicon nanopillar fabrication by silicon plasma etching against anodic aluminum oxide (AAO) mask.
For more information on our silicon plasma etching process capabilities including the Bosch Process etching, please visit the process data pages below.
Silicon Plasma Etching (RIE or ICP Etch)
Silicon Deep Etching Using the Bosch Process
For more detail specs of our RIE etch equipment, please visit the product page below.
RIE Plasma Etcher
Investigating GaSb(001) Dry Etching by ICP-RIE on a non-Silicon Containing Sample Holder with no Organic Gases
Hamad A. Albrithen1, Gale S. Petrich2, Leslie A. Kolodziejski3, Abdelmajid Salhi4 and Abdulrahman A. Almuhanna4
1 Physics and Astronomy, KAIN, King Saud University, Riyadh, Riyadh, Saudi Arabia.
2 Research Laboratory of Electronics, MIT, Cambridge, Massachusetts.
3 Department of Electrical Engineering and Computer Science, MIT, Cambridge, Massachusetts.
4 National Center for Nano Technology Research, King Abdulaziz City for Science and Technology, Riyadh, Riyadh, Saudi Arabia.
MRS Proceedings 2012 1396, mrsf11-1396-o07-33
GaSb plasma etching process over SiO2 mask was investigated using Samco ICP etch system.
Anisotropic GaSb etching with smooth sidewalls were achieved with the recipe optimization.
For more details of our GaSb plasma etching capabilities, please visit the process data page below.
GaSb Plasma Etching
Fabrication of Vertically Aligned Diamond Whiskers from Highly Boron-Doped Diamond by Oxygen Plasma Etching
Chiaki Terashima1, Kazuki Arihara4, Sohei Okazaki4, Tetsuya Shichi4, Donald A. Tryk5, Tatsuru Shirafuji2, Nagahiro Saito1, 2, 3, Osamu Takai1, 2, 3, and Akira Fujishima4, 6
1 Research Center for Materials Backcasting Technology, Graduate School of Engineering, and 2Department of Materials, Physics and Energy Engineering, Graduate School of Engineering, 3 EcoTopia Science Institute, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan
4 Technology Research and Development Department, General Technology Division, Central Japan Railway, 1545-33 Ohyama, Komaki City, Aichi 485-0801, Japan
5 Fuel Cell Nanomaterials Center, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan
6 Tokyo University of Science, 1-3 Kagurazaka, Shinjyuku-ku, Tokyo 162-8601, Japan
ACS Appl. Mater. Interfaces, 2011, 3 (2), pp 177–182
Samco open-load RIE Plasma Etching System was used for diamond plasma etching to fabricate vertically aligned diamond whiskers.
For more details of our diamond plasma etching technologies, please visit the diamond process data page below.
Diamond Dry Etching Process (RIE or ICP-RIE)