Category: 2013 Customer
Scientific Paper on Stress Sensor Fabrication Using SiO2 Plasma Etching from Chinese Academy of Sciences
C. Dou, H. Yang, Y. Wu and X. Li
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on, Suzhou, 2013, pp. 931-934.
Samco open-load RIE etch system was used for SiO2 layer removal in device fabrication.
For more details of our SiO2 plasma etching capabilities, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)
Chamber conditioning process development for improved inductively coupled plasma reactive ion etching of GaAs/AlGaAs materials
Michael K. Connors, Jason J. Plant, Kevin G. Ray, and George W. Turner
Lincoln Laboratory, Massachusetts Institute of Technology
J. Vac. Sci. Technol. B 31, 021207 (2013)
SAMCO ICP Etching System, RIE-200iP was used for GaAs plasma etching process investigation.
For more details of our GaAs plasma etching capabilities, please visit the page below.
GaAs Dry Etching Process (ICP-RIE)
Scientific Paper on Pb(Zr,Ti)O 3 thin film based resonators Using PZT Plasma Etching from Beihang University
Monolithic integration of Pb(Zr,Ti)O3 thin film based resonators using a complete dry microfabrication process
Yonggang Jiang1 , Kensuke Kanda2,3, Yuki Iga2, Takayuki Fujita2,3, Kohei Higuchi2, Kazusuke Maenaka2,3
1 School of Mechanical Engineering and Automation, Beihang University, Xueyuan Road No. 37, Haidian District, Beijing, 100191, China
2 Maenaka Human-Sensing Fusion Project, ERATO, Japan Science and Technology Agency, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
3 Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Microsyst Technol (2013) 19:137–142
SAMCO ICP etch system was used for PZT plasma etching to fabricate thin film MEMS resonators.