Category: 2019 Customer

27 Mar

Scientific paper on 200 nm-period grating Si deep etching (6 µm) by MIT Kavli Institute

Samco 2019 Customer, Samco Customer Publication

Progress in x-ray critical-angle transmission grating technology development

Ralf K. Heilmann,1 Alexander R. Bruccoleri,2 Jungki Song,1 Mark L. Schattenburg1
1MIT Kavli Institute for Astrophysics and Space Research (United States)
2Izentis LLC (United States)
Proc. SPIE 11119, Optics for EUV, X-Ray, and Gamma-Ray Astronomy IX, 1111913 (9 September 2019);

Samco Si DRIE Equipment was used for 200 nm-period grating Si deep etching (6 µm).

12 Jan

Scientific paper on Ga2O3 etching from University of Tsukuba

Samco 2019 Customer, Compound Semiconductor Etching, Ga2O3 Etch, Samco Customer Publication

Dry and wet etching for β-Ga2O3 Schottky barrier diodes with mesa termination

Hironori Okumura1 and Taketoshi Tanaka2
1 Faculty of Pure and Applied Science, University of Tsukuba, Tsukuba 305-8573, Japan
2 Rohm Co. Ltd., Kyoto 615-8585, Japan
Japanese Journal of Applied Physics, 58, 120902 (2019)

Ga2O3 is a compound semiconductor material with a large band-gap energy. Research on this material is still early stage, but more researchers are getting interested in unique material properties.  Dry etching and wet etching of β-Ga2O3 was studied in this paper. Samco ICP-RIE system RIE-400iP was used for mesa structure fabrication in ICP etching of chlorine chemistry.

Profile control of compound semiconductor materials is one of our strong points in material processing. We have accumulated process knowledge on GaN, GaAs, InP, Ga2O3, etc.
If you would like to see some process data, please visit the following webpage.
Process Data by Materials