Multiplexed immunosensing and kinetics monitoring in nanofluidic devices with highly enhanced target capture efficiency

Yii-Lih Lin^1,2,3, Yen-Jun Huang^3,4, Pattamon Teerapanich^5,6, Thierry Leïchlé^5,6 and Chia-Fu Chou^2,3
1 Department of Chemistry, National Taiwan University, Taipei, Taiwan
² Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica and National Taiwan University, Taipei, Taiwan
³ Institute of Physics, Academia Sinica, Taipei, Taiwan
⁴ Department of Physics, National Taiwan University, Taipei, Taiwan
⁵ LAAS-CNRS, 7 Avenue du Colonel Roche, F-31077 Toulouse, France
⁶ Université de Toulouse, F-31077 Toulouse, France
Biomicrofluidics 10, 034114 (2016)

Samco ICP etch system, RIE-10iP was used for nano-slit pattern fabrication by fused quartz plasma etching.

For our process capabilities of SiO₂ and quartz plasma etching, please visit the process data page below.
SiO₂ Dry Etching Process (RIE or ICP-RIE)

Methods of creating and observing atomically reconstructed vertical Si{100}, {110}, and {111} side-surfaces

Azusa N. Hattori^1,2, Shohei Takemoto³, Ken Hattori³, Hiroshi Daimon¹ and Hidekazu Tanaka^1
1 Nanoscience and Nanotechnology Center, The Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
² JST-PRESTO, Kawaguchi, Saitama 332-0012, Japan
³ Graduate School of Materials Science, Nara Institute of Science and Technology, Ikoma, Nara 630-0101, Japan
Appl. Phys. Express (2016) 9 085501

Samco silicon Deep Reactive Ion Etch (DRIE) system at Osaka University was used for silicon nano-scale structure fabrication.

For our process examples and capabilities of deep silicon etching using Bosch Process, please visit the pages below.
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV

Athermal Hybrid Silicon/Polymer Ring Resonator Electro-optic Modulator

Feng Qiu¹, Andrew M. Spring¹, Hiroki Miura², Daisuke Maeda³, Masa-aki Ozawa³, Keisuke Odoi³, and Shiyoshi Yokoyama^{1, 2
1} Institute for Materials Chemistry and Engineering, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
² Department of Molecular and Material Sciences, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
³ Nissan Chemical Industries, LTD, 2-10-1 Tuboi Nishi, Funabashi, Chiba 274-8507, Japan
ACS Photonics
DOI: 10.1021/acsphotonics.5b00695

Silicon plasma etching was performed using Samco silicon DRIE system to fabricate a hybrid silicon/polymer ring resonator electro-optic (EO) modulator.
For our process examples of silicon plasma etching, please visit process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV

Top-Down Nanofabrication and Characterization of 20 nm Silicon Nanowires for Biosensing Applications

M. Nuzaihan M. N ¹, U. Hashim^1,2, M. K. Md Arshad^1,2, A. Rahim Ruslinda¹, S.F.A. Rahman³, M. F. M. Fathil¹, Mohd. H. Ismail^2
1 Institute of Nano Electronic Engineering, Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia,
² School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP), 02600 Pauh, Perlis, Malaysia,
³ Chemistry Department, Faculty of Science, Universiti Putra Malaysia, 43400 UPM Serdang, Selangor, Malaysia
PLoS ONE 11(3): e0152318. doi:10.1371/journal.pone.0152318

Samco ICP etch system at Universiti Malaysia Perlis was used for anisotropic etching of silicon for silicon nanowires fabrication.
For our process examples of silicon dry etching, please visit the process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)

Plasmonic arrays of titanium nitride nanoparticles fabricated from epitaxial thin films

Shunsuke Murai, Koji Fujita, Yohei Daido, Ryuichiro Yasuhara, Ryosuke Kamakura, and Katsuhisa Tanaka
Shunsuke Murai^1,2 Koji Fujita^1,3> Yohei Daido¹ Ryuichiro Yasuhara¹ Ryosuke Kamakura¹ and Katsuhisa Tanaka^1
1 Department of Material Chemistry, Graduate School of Engineering, Kyoto University, Katsura, Nishikyo-ku, Kyoto 615-8510, Japan.
Optics Express Vol. 24, Issue 2, pp. 1143-1153 (2016) •doi: 10.1364/OE.24.001143

Titanium Nitiride (TiN) nanoparticle arrays were fabricated using nanoimprint technologies.
For nanoimprint mold fabrication, Samco deep silicon etching system at Kyoto University was used for nanostructure fabrication on silicon molds. After transferring of the silicon mold pattern to photoresist on TiN substrate, Samco ICP etching system at Kyoto University was used for TiN dry etching over photoresist to fabricate TiN nanoparticle arrays.

Microfluidic chips for forward blood typing performed with a multichannel waveguide-mode sensor

Hiroki Ashiba^a, Makoto Fujimaki^a, Koichi Awazuv, Torahiko Tanaka^b and Makoto Makishima^b
a Electronics and Photonic Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan
^b Division of Biochemistry, Department of Biomedical Sciences, Nihon University School of Medicine, 30-1 Oyaguchi-kamicho, Itabashi, Tokyo 173-8610, Japan
Sensing and Bio-Sensing Research 2016 Volume 7, March 2016, Pages 121-126

Samco ICP etcher was used to fabricate a mold template of microfluidic chips by silicon plasma etching.

For our process capabilities of silicon plasma etching, please visit the process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF₂ Etch)

Enhancement of microfluidic particle separation using cross-flow filters with hydrodynamic focusing

Yun-Yen Chiu, Chen-Kang Huang, and Yen-Wen Lu
Department of Bio-Industrial Mechatronics Engineering, National Taiwan University, Taipei 10617, Taiwan, Republic of China
Biomicrofluidics (2016) 10, 011906

Samco silicon DRIE system at National Taiwan University was used for microchannel fabrication with crossflow filtration mechanism.

For more details of our deep silicon etching capabilities, please visit the process data pages below.
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV

Photonic nanojet induced modes generated by a chain of dielectric microdisks

Cheng-Yang Liu, Chun-Ci Li
Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, New Taipei City, Taiwan
Optik – International Journal for Light and Electron Optics (2016) 127, 1, pp 267–27

Samco Reactive Ion Etching (RIE) system was used for dielectric layer etching to fabricate a microdisc device.

Creation of atomically flat Si{111}7 × 7 side-surfaces on a three-dimensionally-architected Si(110) substrate

Azusa N. Hattori^a, Ken Hattori^b, Shohei Takemoto^b, Hiroshi Daimon^b and Hidekazu Tanaka^a
a Nanoscience and Nanotechnology Center, The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihoga-oka, Ibaraki, Osaka 567-0047, Japan
^b Graduate School of Materials Science, Nara Institute of Science and Technology, Takayama 8916-5, Ikoma, Nara 630-0192, Japan
Surface Science (2016) 644, 86–90

Samco silicon DRIE System was used for deep silicon etching to fabricate three-dimensional (3D) nanostructures.

For more details of our deep silicon etching capabilities, please visit the process data pages below.
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV

Coherent diffraction imaging of non-isolated object with apodized illumination

Krishna P. Khakurel^1,2, Takashi Kimura^1,2,3, Yasumasa Joti⁴, Satoshi Matsuyama^3,4, Kazuto Yamauchi^3,4 and Yoshinori Nishino^1,2,3
1Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-ku, Sapporo, Hokkaido, 001-0021, Japan
²Graduate School of Information Science, Hokkaido University, Kita 21, Nishi 10, Kita-ku, Sapporo, Hokkaido, 001-0021, Japan
³Japan Science and Technology Agency, CREST, 4-1-8 Honcho, Kawaguchi, Saitama 332-0012, Japan
⁴Japan Synchrotron Radiation Research Institute/SPring-8, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5198, Japan
⁵Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan
Optics Express (2015) 23, 22, pp. 28182-28190

SAMCO RIE plasma etcher at Hokkaido University was used for fabrication of coherent diffraction imaging samples.