Category: SiO2 Etch

02 Nov

Scientific Paper on Nano-channel Device Fabrication Using Quartz Plasma Etching from Nagoya University Team

Samco 2016 Customer, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Identifying DNA methylation in a nanochannel

Xiaoyin Suna,b, Takao Yasuia,b,c, Takeshi Yanagidad,e, Noritada Kajia,b, Sakon Rahonga,b, Masaki Kanaid, Kazuki Nagashimad, Tomoji Kawaie and Yoshinobu Babaa,b,f
a Department of Applied Chemistry, Graduate School of Engineering, Nagoya University, Nagoya, Japan;
b ImPAC T Research Center for Advanced Nanobiodevices, Nagoya University, Nagoya, Japan;
c Japan Science and Technology Agency (JST), PRESTO, Saitama, Japan;
d Institute of Materials Chemistry and Engineering, Kyushu University, Fukuoka, Japan;
e Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan;
f Health Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Takamatsu, Japan
Science and Technology of Advanced Materials (2016) VOL . 17, NO . 1, 644–649

A new method to analyze DNA methylation was proposed using a nano-channel device in this research. Samco RIE etch tool was used for  quartz plasma etching over Cr hard mask to fabricate nano-channel structures. The nano-channel device is effective to detect single DNA molecule.

SiO2 Periodic Table

For more details of our SiO2 (quartz) plasma etching capabilities, please visit the process data page below.
SiO2 Plasma Etching Process (RIE and ICP Etch)

06 Aug

Scientific Paper on Fused Silica Nanofluidic Device Fabrication by National Taiwan University Team

Samco 2016 Customer, Microfluidics, Silicon/Dielectrics Etch, SiO2 Etch

Multiplexed immunosensing and kinetics monitoring in nanofluidic devices with highly enhanced target capture efficiency

Yii-Lih Lin1,2,3, Yen-Jun Huang3,4, Pattamon Teerapanich5,6, Thierry Leïchlé5,6 and Chia-Fu Chou2,3
1 Department of Chemistry, National Taiwan University, Taipei, Taiwan
2 Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica and National Taiwan University, Taipei, Taiwan
3 Institute of Physics, Academia Sinica, Taipei, Taiwan
4 Department of Physics, National Taiwan University, Taipei, Taiwan
5 LAAS-CNRS, 7 Avenue du Colonel Roche, F-31077 Toulouse, France
6 Université de Toulouse, F-31077 Toulouse, France
Biomicrofluidics 10, 034114 (2016)

Samco ICP etch system, RIE-10iP was used for nano-slit pattern fabrication by fused quartz plasma etching.

For our process capabilities of SiO2 and quartz plasma etching, please visit the process data page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

07 Jan

Scientific Paper on Microdisc Fabrication from Tamkang University, Taiwan

Samco 2016 Customer, Photonic Devices, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiNx Etch, SiO2 Etch

Photonic nanojet induced modes generated by a chain of dielectric microdisks

Cheng-Yang Liu, Chun-Ci Li
Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, New Taipei City, Taiwan
Optik – International Journal for Light and Electron Optics (2016) 127, 1, pp 267–27

Samco Reactive Ion Etching (RIE) system was used for dielectric layer etching to fabricate a microdisc device.

15 Dec

Scientific Paper on Coherent Diffraction Imaging from Hokkaido University

Samco 2015 Customer, Optics, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Coherent diffraction imaging of non-isolated object with apodized illumination

Krishna P. Khakurel1,2, Takashi Kimura1,2,3, Yasumasa Joti4, Satoshi Matsuyama3,4, Kazuto Yamauchi3,4 and Yoshinori Nishino1,2,3
1Research Institute for Electronic Science, Hokkaido University, Kita 21, Nishi 10, Kita-ku, Sapporo, Hokkaido, 001-0021, Japan
2Graduate School of Information Science, Hokkaido University, Kita 21, Nishi 10, Kita-ku, Sapporo, Hokkaido, 001-0021, Japan
3Japan Science and Technology Agency, CREST, 4-1-8 Honcho, Kawaguchi, Saitama 332-0012, Japan
4Japan Synchrotron Radiation Research Institute/SPring-8, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5198, Japan
5Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan
Optics Express (2015) 23, 22, pp. 28182-28190

SAMCO RIE plasma etcher at Hokkaido University was used for fabrication of coherent diffraction imaging samples.

10 Jul

Scientific Paper on Fabrication of Amorphous Oxide Thin Film Transistors (TFTs) by AIST, Japan

Samco 2015 Customer, ITO Etch, Other Materials Etch, RuO2, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch, TFT

Electrophoretic displays driven by all-oxide thin-film transistor backplanes fabricated using a solution process

Satoshi Inoue, Tue Trong Phan, Tomoko Hori, Hiroaki Koyama and Tatsuya Shimoda
Green Device Research Center, Japan Advanced Institute of Science and Technology, Ishikawa 923-1211, Japan
physica status solidi (a) Volume 212, Issue 10, pages 2133–2140, October 2015

Samco ICP etching system was used for plasma etching of the Ruthenium Oxide (RuO2), Zr-In-Zn-O (ZIZO), Silicon Dioxide (SiO2) and Indium Tin Oxide (ITO) films.

Our process capabilites of SiO2 dry etching can be found in the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

01 Jul

Scientific Paper on Microfluidics Fabrication from Nagoya University, Osaka University and AIST

Samco 2015 Customer, Microfluidics, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Three-dimensional Nanowire Structures for Ultra-Fast Separation of DNA, Protein and RNA Molecules

Sakon Rahong1,2, Takao Yasui2,3, Takeshi Yanagida4, Kazuki Nagashima4, Masaki Kanai4,
Gang Meng4, Yong He4, Fuwei Zhuge4, Noritada Kaji2,3, Tomoji Kawai4 & Yoshinobu Baba1,2,3,5
Institute of Innovation for Future Society, Nagoya University, JAPAN.
FIRST Research Center for Innovative Nanobiodevices, Nagoya University, JAPAN.
Department of Applied Chemistry, Graduate School of Engineering, Nagoya University, JAPAN.
The Institute of Scientific and Industrial Research, Osaka University, JAPAN.
Health Research Institute, National Institute of Advanced Industrial Science and. Technology (AIST), JAPAN.
Scientific Reports 5, Article number: 10584 (2015) doi:10.1038/srep10584

SAMCO Reactive Ion Etching System RIE-10NR was used for SiO2 plasma etching over Cr mask. This process is used for micro-channel fabrication on microfluidic system which enables ultra-fast separation of biomolecules (DNA, Protein and RNA Molecules). SiO2 Periodic Table

For our process examples and capabilities of SiO2 plasma etching, please visit the process data page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

15 Jun

Scientific Paper on MEMS Device Fabrication Using SiO2 Plasma Etching by Kyoto Institute of Technology

Samco 2015 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Buckling behavior of piezoelectric diaphragms for highly sensitive structures of ultrasonic microsensors controlled through intrinsic stress of PZT films

Yamashita, K.; Arai, K.; Tanaka, H.; Nishiumi, T.; Noda, M.
Graduate School of Science & Technology, Kyoto Institute of Technology, Kyoto, Japan
presented at Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the , vol., no., pp.44-47, 24-27 May 2015

SiO2 Periodic Table

SAMCO silicon DRIE system at Kyoto Institute of Technology was used for Silicon Dioxide (SiO2) dry etching.
Our DRIE systems are equipped with SiO2 etch kit for high-speed SiO2 plasma etching. For more details, please visit our product page below.
Silicon Deep Reactive Ion Etching (DRIE) Systems

Also, for our process capabilities of SiO2 plasma etching, please visit the process data page below.
SiO2 Plasma Etching Process Data (RIE or ICP Etch)

22 Feb

Scientific Paper on SU-8 Membrane Fabrication Using SiO2 Dry Etching by AIST, Japan

Samco 2015 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Performance of SU-8 Membrane Suitable for Deep X-Ray Grayscale Lithography

Harutaka Mekaru
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of
Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
Micromachines 2015, 6, 252-265

Samco open-load RIE Plasma Etching System was used for SiO2 dry etching in the device fabrication. The SiO2 layer was successfully removed without breaking the SU-8 membrane.

SiO2 Periodic Table

For our process capabilities of SiO2 dry etching, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

27 Sep

Scientific Paper on Microfluidics Fabrication Using Glass Dry Etching by National Tsing Hua University, Taiwan

Samco 2014 Customer, Microfluidics, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

DNA combing on low-pressure oxygen plasma modified polysilsesquioxane substrates for single-molecule studies

K. K. Sriram1,2,3 Chun-Ling Chang3 U. Rajesh Kumar1,4,5 and Chia-Fu Chou3,6,7
Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica, Taipei 11529, Taiwan
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
Institute of Physics, Academia Sinica, Taipei 11529, Taiwan
Institute of Atomic and Molecular Sciences, Academia Sinica, Taipei 10617, Taiwan
Department of Chemistry, National Taiwan University, Taipei 10617, Taiwan
Genomics Research Center, Academia Sinica, Taipei 11529, Taiwan
Research Center for Applied Sciences, Academia Sinica, Taipei 11529, Taiwan
Biomicrofluidics (2014) 8, 052102

SAMCO ICP Etch System was used for microchannel fabrication on fused silica glass substrates.

For more details of our glass dry etch technologies (SiO2, fused silica and quartz), please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

28 Jul

Scientific Paper on Metallic Infrared Filter Fabrication Using Al Plasma Etching by NIMS, Japan

Samco 2013 Customer, Al Etch, Other Materials Etch, Photonic Devices, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Structural Optimization of Metallic Infrared Filters Based on Extraordinary Optical Transmission

Makoto Ohkado1, Tsuyoshi Nomura1, Atushi Miura1, Hisayoshi Fujikawa1, Naoki Ikeda2, Yoshimasa Sugimoto2 and Shinji Nishiwaki3
1Toyota Central R&D Labs. Inc., 41-1 Yokomichi, Nagakute, Aichi 480-1192, Japan
2National Institute for Material Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan
3Kyoto University, Yoshida Honmachi, Sakyo-ku, Kyoto, Kyoto 606-8501, Japan
Transactions of the Materials Research Society of Japan (2013) 38, No. 2 p. 167-170

SiO2 plasma etching and Al plasma etching were performed using Samco RIE system and ICP etch system, respectively to fabricate hole array structures of the infrared filter.

For more details of our SiO2 dry etching capabilities, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

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