Scientific Paper Using SAMCO DRIE System at Princeton University
So Youn Kim 1, Jessica Gwyther 2, Ian Manners 2, Paul M. Chaikin 3, and Richard A. Register 1
1 Department of Chemical and Biological Engineering, Princeton University, Princeton, NJ, USA
2 School of Chemistry, University of Bristol, Bristol, United Kingdom
3 Department of Physics, New York University, New York, USA
Adv. Mater., 26, 791-795 (2014)
Samco Silicon DRIE System at Princeton University was used for deep silicon etching using the Bosch Process.
For more details of our deep silicon etching capabilities, please visit the page below.
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV
Silicon Deep Etching Using the Bosch Process