Fabrication of Vertically Aligned Diamond Whiskers from Highly Boron-Doped Diamond by Oxygen Plasma Etching

Chiaki Terashima¹, Kazuki Arihara⁴, Sohei Okazaki⁴, Tetsuya Shichi⁴, Donald A. Tryk⁵, Tatsuru Shirafuji², Nagahiro Saito^{1, 2, 3}, Osamu Takai^{1, 2, 3}, and Akira Fujishima^{4, 6
1} Research Center for Materials Backcasting Technology, Graduate School of Engineering, and ²Department of Materials, Physics and Energy Engineering, Graduate School of Engineering, ³ EcoTopia Science Institute, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan
⁴ Technology Research and Development Department, General Technology Division, Central Japan Railway, 1545-33 Ohyama, Komaki City, Aichi 485-0801, Japan
⁵ Fuel Cell Nanomaterials Center, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan
⁶ Tokyo University of Science, 1-3 Kagurazaka, Shinjyuku-ku, Tokyo 162-8601, Japan
ACS Appl. Mater. Interfaces, 2011, 3 (2), pp 177–182
DOI: 10.1021/am1007722

Samco open-load Plasma Etching System was used for diamond plasma etching to fabricate vertically aligned diamond whiskers.

For more details of our diamond plasma etching technologies, please visit the diamond process data page below.
Diamond Dry Etching Process (RIE or ICP-RIE)