Samco offers multiple ICP etch systems for production-based batch processing.
These systems have been field-proven by most major manufacturers of several markets including high-brightness light-emitting-diode (HB LED) production.
Loadlock-based ICP Etch Systems
Featuring unique Tornado coils which show high etch uniformity over the wafers in batch processing
Cassette-based ICP Etch Systems
Capable of handling trays for high-volume batch processing
ICP Etch Systems with Carousel Options
Carousel options suitable for factory automation where single substrate cassettes are transferred to batch trays
Samco ICP systems for batch processing are used at HB-LED fabs for PSS fabrication and controlled GaN etching.
For more process data, please visit our Process Data Page.
Patterned Sapphire Substrate (PSS) fabrication
Cone profile (height and width) is highly adjustable.
GaN reverse tapered etching for device isolation
Anisotropic GaN etching on sapphire substrates
Samco ICP etch systems for batch processing are designed to enhance etch uniformity and process repeatability over multiple wafers.
The three dimensional coil generates high ion density and enables high-uniformity etching over the wafers.
Tornado Coil (SSTC)
Auto-matching unit works as a RF power divider to inner and outer coil, and enables high etch uniformity over a large area.
Symmetrical Evacuation Design for High Uniformity
Symmetrical pumping design improves etch uniformity per process.
By using the SSTC coil and symmetrical pumping system, SiO2 etching data across a ø330 mm wafer carrier shows etch uniformity of ± 4.2% with average etch rate of 107.8 nm/min.