ICP Etch Systems for Batch Processing

SAMCO Inc. > Etching Systems > ICP Etch Systems for Batch Processing

Product Lineup

SAMCO offers multiple ICP etch systems for production-based batch processing.
These systems have been field-proven by most major manufacturers of several markets including high-brightness light-emitting-diode (HB LED) production.

Loadlock-based ICP Etch Systems

Loadlock ICP Etch Systems for Batch Processing

Featuring unique Tornado coils which show high etch uniformity over the wafers in batch processing

Cassette-based ICP Etch Systems

ICP Etch System for LED production

Capable of handling trays for high-volume batch processing

ICP Etch Systems with Carousel Options

Carousel for wafer transfer

Carousel options suitable for factory automation where single substrate cassettes are transferred to batch trays

Process Examples

SAMCO ICP systems for batch processing are used at HB-LED fabs for PSS fabrication and controlled GaN etching.
For more process data, please visit our Process Data Page.

Patterned Sapphire Substrate (PSS) by plasma etching

Patterned Sapphire Substrate (PSS) fabrication
Cone profile (height and width) is highly adjustable.

GaN Reverse Taper Etch for LED

GaN reverse tapered etching for device isolation

Anisotropic GaN Etching

Anisotropic GaN etching on sapphire substrates

Specification Chart

ICP Etch Systems for Batch Processing
Loading Load-lock Cassette loading
Sample Size 230 mm 330 mm 230 mm 330/350 mm
Batch Process Capability 27 x ø2”
2 x ø3”
7 x ø4”
3 x ø6”
27 x ø2”
12 x ø3”
7 x ø4”
3 x ø6”
27 x ø2”
12 x ø3”
7 x ø4”
3 x ø6”
27 x ø2” (330 mm)
29 x ø2″ (350 mm)
12 x ø3”
7 x ø4”
3 x ø6”
Chuck Type Electrostatic chuck (ESC) with Helium backside cooling
Pumping Type Symmetrical Pumping
Vacuum System Turbo Pump with Rotary Backing Pump
Gases Up to 8 gas lines
ICP Power 1 KW
Tornado ICP Coil
1/1.7 KW
SSTC Coil
1 KW
Tornado ICP Coil
1/1.7 KW
SSTC Coil
Bias Power 500 W 1 KW 500 W 1 KW
Chuck Temperature Range -10~250°C
System Control Easy-to-use Touch-panel GUI
Endpoint Option Optical/Interferometric End-point Detection
Applications PSS fabrication on sapphire substrates

GaN etching for device isolation

System Features

SAMCO ICP etch systems for batch processing are designed to enhance etch uniformity and process repeatability over multiple wafers.

Unique
Tornado Coil

Tornado ICP Coil

The three dimensional coil generates high ion density and enables high-uniformity etching over the wafers.

Symmetrically Shielded
Tornado Coil (SSTC)

Symmetrically Shielded Tornado Coil

Auto-matching unit works as a RF power divider to inner and outer coil, and enables high etch uniformity over a large area.

Symmetrical Evacuation Design for High Uniformity

Symmetrical Evacuation Design for High Uniformity

Symmetrical pumping design improves etch uniformity and process repeatability.

SiO2 Etch Uniformity

By using the SSTC coil and symmetrical pumping system, SiO2 etching data across a ø330 mm wafer carrier shows etch uniformity of ± 4.2% with average etch rate of 107.8 nm/min.

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.
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