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HOME
About Samco
NEWS
Events
Global Location
Disclosure
Careers
PRODUCTS
Deposition Systems
Anode PECVD Systems
Cathode PECVD Systems
ALD System
Etching Systems
RIE Systems
ICP Etch Systems for General Purpose
ICP Etch Systems for SiC Etching
ICP Etch Systems for Batch Processing
DRIE Systems
XeF
2
Etch System
Cleaning Systems
Plasma Cleaners (Direct Plasma)
Remote Source Plasma Cleaners (Downstream Plasma)
UV-Ozone Cleaners
Basic Plasma Research Kit
Markets
MEMS
Laser Diodes
HB LEDs
TSV
SAW Devices
RF Devices
Featured Solutions
PECVD
Low-temperature PECVD for SiO
2
& SiN
x
Deposition
Cathode PECVD for High-rate SiO
2
and SiN
x
deposition
Plasma Etching
Compound Semiconductor Etching
Si DRIE for MEMS and TSV
Plasma Dicing of Si & III-V (GaAs/InP/GaN)
GaN/AlGaN Etch for GaN Power Device Fabrication
SiC Trench Etch for SiC MOSFET Power Device Fabrication
Sapphire & GaN Etch for HB LEDs
Depassivation for IC Failure Analysis
Photoresist Removal/Ashing
Surface Treatment & Other
Polymer Plasma Treatment & Bonding for Microfluidics
Copper & Silver Plasma Cleaning without Surface Oxidation for Electronics Packaging
Depassivation for IC Failure Analysis
Photoresist Removal/Ashing
TECH RESOURCES
Process Data by Materials
Publication
Tech Notes
Process Technology Tutorials
The Bosch Process (Silicon Deep RIE)
UV-Ozone Cleaning
Customer Publication
– Search by Application
MEMS
Power Devices
LEDs
Microfluidics
Photonic Devices
Customer Publication
– Search by Process Type
Silicon/Dielectrics PECVD
Silicon/Dielectrics Etch
Compound Semi Etch
Other Materials Etch
Surface Treatment
CONTACT US
Product Info Request
Technical Support Request
fy7.2019-3q results
June 12, 2019
June 12, 2019
Samco
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