1. Electrode Formation (Metal Etching)
Aluminum Etching was performed using an ICP etch system.
The etched profile showed vertical sidewalls.
Etch Rate : 1.4 µm/min
Etch Selectivity : 1.95 (over Photoresist)
3. Substrate Trimming (IDT Fabrication)
LiNbO3 plasma etching was performed using an ICP etch system for fabrication of interdigital transducer (IDT), and smooth sidewalls were achieved. Other piezoelectric materials including quartz can be also processed for IDT fabrication.
4. Passivation Film Deposition
SAMCO’s cathode PECVD systems give advantages of high deposition uniformity for batch processing.
9 point measurement of 10 mm wafer edge for 3 x Ø4-inch wafers shows high wafer-to-wafer SiO2 deposition uniformity around ±1.5 %.
Aluminum electrodes were covered with a SiO2 passivation film without void.