1. Electrode Formation (Metal Etching)
Aluminum Etching was performed using an ICP etch system.
The etched profile showed vertical sidewalls.
Etch Rate : 1.4 µm/min
Etch Selectivity : 1.95 (over Photoresist)
4. Passivation Film Deposition
SAMCO’s cathode PECVD systems give advantages of high deposition uniformity for batch processing.
9 point measurement of 10 mm wafer edge for 3 x Ø4-inch wafers shows high wafer-to-wafer SiO2 deposition uniformity around ±1.5 %.
Aluminum electrodes were covered with a SiO2 passivation film without void.