SAW Device Manufacturing Process

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 1. Electrode Formation (Metal Etching)

Electrode Formation (Metal Etching)
Aluminum Etching for Electrode Formation
Aluminum Etching for Electrode Formation

Aluminum Etching was performed using an ICP etch system.
The etched profile showed vertical sidewalls.

Etch Rate : 1.4 µm/min
Etch Selectivity : 1.95 (over Photoresist)

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2. Photoresist Removal

Photoresist Removal
Bench-top Plasma Cleaner
Plasma Asher Chamber

SAMCO offers plasma cleaning systems and RIE systems for photoresist removal.

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3. Substrate Trimming

Substrate Trimming
LiNbO3 LiTaO3 Etching
LiNbO3 LiTaO3 Etching

LiNbO3 etching was performed using an ICP etch system. The etched sample showed smooth sidewalls.

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4. Passivation Film Deposition

Passivation Film Deposition
SiO2 Deposition Uniformity
SiO2 Gap Filling Without Void

SAMCO’s cathode PECVD systems give advantages of high deposition uniformity for batch processing.
9 point measurement of 10 mm wafer edge for 3 x Ø4-inch wafers shows high wafer-to-wafer SiO2 deposition uniformity around ±1.5 %.

Aluminum electrodes were covered with a SiO2 passivation film without void.

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5. Contact Hole Formation

Contact Hole Formation
Atmospheric Robot for Wafer Transfer

State-of-the-art robots will improve process throughput with quick wafer transfer.

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7. Dicing

Dicing for SAW Device Fabrication
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8. Surface Cleaning before Wire Bonding

SAW Device
Plasma Cleaner for SAW Device Manufacturing
Multiple Shelves

SAMCO’s bench-top plasma cleaners can process multiple wafers with additional shelves.

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.
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