Samco joins SEMICON WEST 2016.

Date : July 12 – 16, 2016
Location : Moscone Center, San Francisco, CA, USA
Booth : 1709

Highlights:
· Process solutions for SiC and GaN power device fabrication
· Plasma dicing/scribing solutions for compound semiconductors (GaAs, InP and GaN)
· Small-footprint plasma cleaning systems equipped with three plasma modes (RIE mode, plasma etch mode and dowstream mode) for various R&D projects
· Silicon DRIE process solutions for MEMS device fabrication and TSV
We have strengthened process technologies of deep silicon etching and expanded product portfolio of single-chamber system and double-chamber system for production.

Feel free to visit our booth for discussion about your interest in material processing.

Request Meeting with SAMCO >