Scientific Paper on MEMS Diaphragm Sensor from Kyoto Institute of Technology

December 5, 2016 Samco 2016 Customer, Samco Customer Publication, Si DRIE, Silicon/Dielectrics Etch

Influence of top electrodes to vibration modes in impulse responses of MEMS piezoelectric diaphragms for ultrasonic microsensors

T. Nishioka, T. Nishiumi, K. Yamashita and M. Noda
Graduate School of Science and Technology, Kyoto Institute of Technology, Matsugasaki, 606-8585, Japan
2016 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK), Kyoto, 2016, pp. 1-2.
doi: 10.1109/IMFEDK.2016.7521705

Ultrasonic micro sensors with piezoelectric diaphragms were fabricated to investigate the relationship between vibration mode and device structure of electrode and the diaphragms. Samco Deep Reactive Ion Etching system was used for anisotropic silicon plasma etching in the Bosch Process over SiO2 mask.

Silicon Periodic Table

For more details of our silicon plasma etching capabilities, please visit the process data pages below.

Silicon Plasma Etching Process Data (RIE and ICP-RIE)
Silicon Deep RIE Process Data Using the Bosch Process

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