Scientific Paper on Hybrid Silicon/Polymer Ring Resonator Fabrication from Kyushu University Team
Feng Qiu1, Andrew M. Spring1, Hiroki Miura2, Daisuke Maeda3, Masa-aki Ozawa3, Keisuke Odoi3, and Shiyoshi Yokoyama1, 2
1 Institute for Materials Chemistry and Engineering, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
2 Department of Molecular and Material Sciences, Kyushu University, 6-1 Kasuga-koen Kasuga-city, Fukuoka 816-8580, Japan
3 Nissan Chemical Industries, LTD, 2-10-1 Tuboi Nishi, Funabashi, Chiba 274-8507, Japan
Silicon plasma etching was performed using Samco silicon DRIE system to fabricate a hybrid silicon/polymer ring resonator electro-optic (EO) modulator.
For our process examples of silicon plasma etching, please visit process data page below.
Si Dry Etching Process (RIE, ICP-RIE or XeF2 Etch)
Deep Silicon Trench/Via Hole Etching using Bosch Process
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV