Scientific Paper on TiN Nanoparticle Array Fabrication Process by Kyoto University

March 2, 2016 Samco Other Materials Etch, Si DRIE, Silicon/Dielectrics Etch, TiN Etch

Plasmonic arrays of titanium nitride nanoparticles fabricated from epitaxial thin films

Shunsuke Murai, Koji Fujita, Yohei Daido, Ryuichiro Yasuhara, Ryosuke Kamakura, and Katsuhisa Tanaka
Shunsuke Murai1,2 Koji Fujita1,3> Yohei Daido1 Ryuichiro Yasuhara1 Ryosuke Kamakura1 and Katsuhisa Tanaka1
1 Department of Material Chemistry, Graduate School of Engineering, Kyoto University, Katsura, Nishikyo-ku, Kyoto 615-8510, Japan.
Optics Express Vol. 24, Issue 2, pp. 1143-1153 (2016) •doi: 10.1364/OE.24.001143

Titanium Nitiride (TiN) nanoparticle arrays were fabricated using nanoimprint technologies.
For nanoimprint mold fabrication, Samco deep silicon etching system at Kyoto University was used for nanostructure fabrication on silicon molds. After transferring of the silicon mold pattern to photoresist on TiN substrate, Samco ICP etching system at Kyoto University was used for TiN dry etching over photoresist to fabricate TiN nanoparticle arrays.

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