Scientific Paper on SU-8 Membrane Fabrication Using SiO2 Dry Etching by AIST, Japan

February 22, 2015 Samco 2015 Customer, MEMS, Samco Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Performance of SU-8 Membrane Suitable for Deep X-Ray Grayscale Lithography

Harutaka Mekaru
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of
Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
Micromachines 2015, 6, 252-265

Samco open-load RIE Plasma Etching System was used for SiO2 dry etching in the device fabrication. The SiO2 layer was successfully removed without breaking the SU-8 membrane.

SiO2 Periodic Table

For our process capabilities of SiO2 dry etching, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

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