Scientific Paper on Stress Sensor Fabrication Using SiO2 Plasma Etching from Chinese Academy of Sciences
C. Dou, H. Yang, Y. Wu and X. Li
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on, Suzhou, 2013, pp. 931-934.
Samco open-load RIE etch system was used for SiO2 layer removal in device fabrication.
For more details of our SiO2 plasma etching capabilities, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)