SEMICON WEST 2017
Date : July 11 – 13, 2017
Location : Moscone Center, San Francisco,
California, USA
Booth : 7809
Highlights :
• Silicon Deep RIE and piezoelectric materials (PZT/AlN) etching for MEMS device fabrication
• Low-stress and low-temperature PECVD technologies of SiO2 and SiNx films
• Surface modification (plasma cleaning and UV-ozone cleaning) prior to wire bonding and metal plating