A sub-micron-gap soi capacitive accelerometer array utilizing size effect
Matsui, Y., Hirai, Y., Tsuchiya, T. and Tabata, O.
Dept. of Micro Eng., Kyoto Univ., Kyoto, Japan
Presented at 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) at Anchorage, AK.
Samco Silicon DRIE System at Kyoto University was used for deep silicon etching in MEMS device fabrication.
Our process examples and capabilities of deep silicon etching can be found in the page below.
Deep Silicon Trench/Via Hole Etching using Bosch Process
Kyoto University is one of the proprietary customers of Samco silicon DRIE System for MEMS device fabrication.