Process Solutions for HB LED Manufacturing
SAMCO Inc. > Markets > Process Solutions for HB LED Manufacturing
1. PSS Fabrication by Sapphire Etching
Samco offers Patterned Sapphire Substrate (PSS) fabrication processes using ICP plasma etching technologies. The height and width of cone shape is adjustable with customers’ requests.
2. p-GaN/Active/n-GaN Layer Deposition by MOCVD
3. Expose n-GaN Layer by Dry Etching
GaN etching with smooth sidewalls and bottom can be achieved by experienced process recipes.
4. Electrode Formation
5. Device Isolation by GaN Etching
Sidewall angle of GaN layer is highly controllable from positive to negative profile.
6. Passivation Deposition by PECVD
Batch processing of 6 x Ø4-inch wafers show high uniformity of SiO2 deposition.
Batch-to-batch Deposition Uniformity : ±0.2 %
Deposition Rate : 12.2 nm/min
7. Contact Hole Formation
Double Cassettes and multi-joint robot wafer handling of Samco’s atmospheric cassette RIE etchers improve throughput of SiO2 etching for contact hole formation. The systems show stable SiO2 etch uniformity around ± 1.5% over 25 x ø4”wafers.
8. Dicing and Wire Bonding
Samco offers plasma scribing processes for compound semiconductor materials. Single wafer processing and batch processing of small wafers are available using state-of-the-art wafer handling methods.
9. Dry Cleaning and Phosphor Coating before Packaging
Samco’s atmospheric cassette UV-Ozone cleaners provide automated surface cleaning solutions before packaging.
