Category: MEMS

22 Oct

Scientific Paper on ITO Gas Sensor Fabrication from Bilkent University, Turkey

Samco 2016 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, Silicon/Dielectrics PECVD, SiNx Etch, SiNx PECVD

Planar Indium Tin Oxide Heater for Improved Thermal Distribution for Metal Oxide Micromachined Gas Sensors

M. Cihan Çakır1,2 ,Deniz Çalışkan1, Bayram Bütün1 and Ekmel Özbay1,3
1 Nanotechnology Research Center, Bilkent University, Ankara 06800, Turkey
2 Department of Nanotechnology and Nanomedicine, Hacettepe University, Ankara 06800, Turkey
3 Department of Electrical and Electronics Engineering, Department of Physics, Bilkent University, Ankara 06800, Turkey

Samco PECVD system at Bilkent University was used for Si3N4 film deposition to form an etch stop layer in Si wet etching. Furthermore, Samco ICP-RIE plasma etcher at Bilkent University was used for plasma etching of Si3N4 against Si etch mask for ITO gas sensor fabrication.

For more information on our Si3N4 PECVD process capabilities, please visit the process data page below.
Si3N4 PECVD Process Data

For more details of Samco PECVD systems and ICP-RIE systems, please visit product pages below.
Anode PECVD Systems for SiO2, Si3N4, a-Si, SiON, SiCN & DLC Deposition
Cathode PECVD Systems for High-speed SiO2 and Si3N4 Film Deposition
ICP-RIE Plasma Etcher for Si, SiO2, III-V & Metal Etching

29 Feb

Scientific Paper on Flexible Touch Sensors and Organic Transistors from University of Tokyo

Samco 2016 Customer, MEMS, SAMCO Customer Publication

300-nm Imperceptible, Ultraflexible, and Biocompatible e-Skin Fit with Tactile Sensors and Organic Transistors

Robert A. Nawrocki1, Naoji Matsuhisa1,2, Tomoyuki Yokota1 and Takao Someya1
1 Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, Bunkyo-ku, Tokyo, Japan
2 Advanced Leading Graduate Course for Photon Science, Bunkyo-ku, Tokyo, Japan
Advanced Electronic Materials (2016)

Samco open-load RIE etcher was used for contact hole formation of encapsulation layers.

20 Jul

Scientific Paper on Capacitive Accelerometer Fabrication Using Si DRIE Process by Kyoto University

Samco 2015 Customer, MEMS, SAMCO Customer Publication, Si DRIE, Silicon/Dielectrics Etch

A sub-micron-gap soi capacitive accelerometer array utilizing size effect

Matsui, Y.,  Hirai, Y., Tsuchiya, T. and Tabata, O.
Dept. of Micro Eng., Kyoto Univ., Kyoto, Japan
Presented at 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) at Anchorage, AK.

Samco Silicon DRIE System at Kyoto University was used for deep silicon etching in MEMS device fabrication.

Silicon Periodic Table
Our process examples and capabilities of deep silicon etching can be found in the page below.
Deep Silicon Trench/Via Hole Etching using Bosch Process

Kyoto University is one of the proprietary customers of Samco silicon DRIE System for MEMS device fabrication.

Go to Tabata Lab, Kyoto University

15 Jun

Scientific Paper on MEMS Device Fabrication Using SiO2 Plasma Etching by Kyoto Institute of Technology

Samco 2015 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Buckling behavior of piezoelectric diaphragms for highly sensitive structures of ultrasonic microsensors controlled through intrinsic stress of PZT films

Yamashita, K.; Arai, K.; Tanaka, H.; Nishiumi, T.; Noda, M.
Graduate School of Science & Technology, Kyoto Institute of Technology, Kyoto, Japan
presented at Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the , vol., no., pp.44-47, 24-27 May 2015

SiO2 Periodic Table

SAMCO silicon DRIE system at Kyoto Institute of Technology was used for Silicon Dioxide (SiO2) dry etching.
Our DRIE systems are equipped with SiO2 etch kit for high-speed SiO2 plasma etching. For more details, please visit our product page below.
Silicon Deep Reactive Ion Etching (DRIE) Systems

Also, for our process capabilities of SiO2 plasma etching, please visit the process data page below.
SiO2 Plasma Etching Process Data (RIE or ICP Etch)

22 Feb

Scientific Paper on SU-8 Membrane Fabrication Using SiO2 Dry Etching by AIST, Japan

Samco 2015 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Performance of SU-8 Membrane Suitable for Deep X-Ray Grayscale Lithography

Harutaka Mekaru
Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of
Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
Micromachines 2015, 6, 252-265

Samco open-load RIE Plasma Etching System was used for SiO2 dry etching in the device fabrication. The SiO2 layer was successfully removed without breaking the SU-8 membrane.

SiO2 Periodic Table

For our process capabilities of SiO2 dry etching, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

19 Aug

Scientific Paper on MEMS Probe Fabrication Using the Bosch Process Etching by Princeton University

Samco 2014 Customer, MEMS, SAMCO Customer Publication, Si DRIE, Silicon/Dielectrics Etch

Fabrication and Characterization of a Novel Nanoscale Thermal Anemometry Probe

Margit Vallikivi and Alexander J. Smits
Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08544 USA
Journal of Microelectromechanical Systems (2014) 23 , 4

Samco Silicon DRIE System at Princeton University was used for slope formation from a silicon substrate to fabricate a MEMS-based nanoscale thermal anemometry probe.

Silicon Periodic Table

For more details of our deep silicon etching capabilities using the Bosch Process, please visit the page below.
Si DRIE (Deep Reactive Ion Etching) for MEMS and TSV
Deep Silicon Etching Process Data Using the Bosch Process

22 Jun

Scientific Paper on Stress Sensor Fabrication Using SiO2 Plasma Etching from Chinese Academy of Sciences

Samco 2013 Customer, MEMS, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

A transfer technique of stress sensors for versatile applications

C. Dou, H. Yang, Y. Wu and X. Li
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on, Suzhou, 2013, pp. 931-934.
doi: 10.1109/NEMS.2013.6559876

Samco open-load RIE etch system was used for SiO2 layer removal in device fabrication.

SiO2 Periodic Table

For more details of our SiO2 plasma etching capabilities, please visit the page below.
SiO2 Dry Etching Process (RIE or ICP-RIE)

10 Jan

Scientific Paper on Pb(Zr,Ti)O 3 thin film based resonators Using PZT Plasma Etching from Beihang University

Samco 2013 Customer, MEMS, Other Materials Etch, PZT Etch, SAMCO Customer Publication

Monolithic integration of Pb(Zr,Ti)O3 thin film based resonators using a complete dry microfabrication process

Yonggang Jiang1 , Kensuke Kanda2,3, Yuki Iga2, Takayuki Fujita2,3, Kohei Higuchi2, Kazusuke Maenaka2,3
1 School of Mechanical Engineering and Automation, Beihang University, Xueyuan Road No. 37, Haidian District, Beijing, 100191, China
2 Maenaka Human-Sensing Fusion Project, ERATO, Japan Science and Technology Agency, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
3 Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Microsyst Technol (2013) 19:137–142

SAMCO ICP etch system was used for PZT plasma etching to fabricate thin film MEMS resonators.

02 Dec

Scientific Paper on Miniature Fuel Cell Fabrication from Tokyo University of Science

Samco 2010 Customer, MEMS, SAMCO Customer Publication, Si Etch, Silicon/Dielectrics Etch

Miniature Fuel Cell with Monolithically Fabricated Si Electrodes-Reduction of Pt Usage by Pd-Pt Catalyst

Takayuki Honjo, Taku Matsuzaka and Masanori Hayase
Tokyo University of Science, Noda, Chiba, Japan
Presented at Power MEMS 2010, Nov 30-Dec 3, Leuven, Belgium

Samco RIE Etcher was used for silicon plasma etching over Cu mask in fuel channel fabrication of miniature fuel cells.

silicon etching
For more details of our silicon etching technologies, please visit the process data pages below.
Si Dry Etching Process (RIE, ICP-RIE or XeF2 Etch)
Deep Silicon Trench/Via Hole Etching using Bosch Process

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