Samco’s Xenon difluoride (XeF2) Etching Systems are mainly used for the etching of the Si sacrificial layer for fabrication of MEMS (Micro Electro Mechanical Systems) devices. This dry process avoids the destruction of devices due to stiction, which is a problem in the wet process, and eliminates the need for pre-treatment and post-processing in the wet process.
XeF2 System Lineup
Key Features & Benefits
- Dry process with no electrical damage
- Easy etch rate control
- Compact with high cost performance
Applications
- Si Sacrificial layer etching during the formation of MEMS