1979

Sep.

Samco International, Inc. was established

1980

Jul.

Released large CVD system for semiconductor process

1981

Apr.

Released Japan’s first MOCVD system

1984

Jun.

Opened Tokyo branch office

1985

Jul.

Moved HQ to current location

Jul.

Started selling products of March Instruments Inc. (now NORDSON CORPORATION)

1987

Feb.

Opened OPTO films research laboratory in Sunnyvale

1990

Nov.

Released LSCVD® system for processing of TEOS SiO2 film

1991

Mar.

Opened R&D Center I in Kyoto

1993

Feb.

Opened Tsukuba Office

Sep.

Opened Tokai Branch

1994

Feb.

Released ferroelectric film deposition system using technology of Symetrix Corporation

1995

Jul.

Developed the CFC pollution-free technique using thin film technology

Dec.

 Released compact reactive ion etching system RIE-10NR

1996

Dec.

Released ICP etching system RIE-101iP

1997

Nov.

Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd.

Nov.

Released ICP etching system RIE-200iP

1998

Dec.

Released compact PECVD system PD-220

1999

Jul.

Acquired field support business from Samco Engineering Co., Ltd.

2000

Jan.

Opened Cambridge Research Laboratory at University of Cambridge, UK

2001

May

Became publicly listed in JSDA Over-the-Counter Trading Securities Market

Jul.

Opened Taiwan Office

2002

Jul.

Opened Production Center I in Kyoto

2003

Nov.

Released production type PECVD system PD-220LC

Dec.

Introduced high speed silicon deep etching technology from Robert Bosch GmbH

2004

Nov.

Opened Shanghai Office

Dec.

Changed company name to Samco Inc.

Dec.

Withdrew from JSDA Over-the-Counter Trading Securites Market and became publicly listed in JASDAQ Securities Exchange Market

2005

May

Released plasma CVD system PD-2203L (Cluster Lab) for general purpose

Sep.

Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of Cambridge

Dec.

Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrate

2006

May

Opened Product Service Center

May

Released dry etching system RIE-800iPB for MEMS

Sep.

Signed a collaborative research agreement with Tsinghua University (China)

2007

Nov.

Released ICP etching system RIE-140iP for LD

2008

Mar.

Opened R&D Center II in Kyoto

May

Released production type MOCVD system MCV-2018 for GaN film deposition

Oct.

Established a subsidiary, Samco Global Service Inc., in Taiwan for field support

Nov.

Released production type ICP etching system RIE-330iPC for LED

2009

Jan.

Started running of Samco Global Service Inc.

Apr.

Held 30th anniversary event at Kyoto Hotel Okura

Oct.

Released R&D type dry etching system RIE-400iPB for MEMS

2010

Apr.

Became listed in Osaka Securies Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc.

Jul.

Released production type plasma CVD system PD-330STC for TSV

Jul.

Released production type plasma CVD system PD-5400 for LED

Aug.

Opened East Coast Office in North Carolina, U.S. (Relocated to New York in May 2014)

Sep.

Opened Beijing Office

2011

Dec.

Released production type ICP etching system RIE-331iPC for LED

2012

Nov.

Released ICP etching system RIE-600iP for SiC power device

2013

Jul.

Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second Section

Oct.

Released production type ICP etching system RIE-600iPC for SiC power device

Nov.

Released production type RIE system RIE-800iPBC for MEMS

2014

Jan.

Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section

Mar.

Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.)

May

Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG)

2015

Sep.

Increased capital to JPY 1.66 billion through public offering

Dec.

Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden)

Dec.

Released ALD system AL-1 for electronic devices

2016

Jun.

Opened Production Center II in Kyoto

Aug.

Opened Malaysia Office

Sep.

Released Aqua Plasma™ cleaner AQ-2000

2018

Dec.

Released compact ICP etching system RIE-200iPN

2019

Sep.

Held 40th anniversary event at Kyoto Hotel Okura

2020

Jul.

Opened PECVD and ALD demonstration facility in the Production Building II

2021

Dec.

Released cluster tool system Cluster H™ for compound semiconductor device

Mar.

Developed plasma techniques for inactivation of coronaviruses

2022

Mar.

Opened research center for nano thin films & materials

Apr.

Transferred Samco’s stock listing to Prime Market of the Tokyo Stock Exchange

Oct.

Released plasma enhanced ALD system AD-800LP

2023

Oct.

Released three-chamber plasma enhanced CVD system PD-2203LC

Nov.

Started research collaboration with Eastern Switzerland University of Applied Sciences (OST)

Nov.

Decided to construct third R&D facility for innovative semiconductor process equipment

2024

May

Started to construct third R&D facility; Advanced Technology Development Center