Visiting Samco’s Partner Companies
New employees visited Taisei Weld and Ushikoshi to learn how precision welding and metal fabrication support Samco’s semiconductor systems.
We are Samco Inc.
Established in 1979, Samco began as a garage start-up in Kyoto, aiming to provide cutting-edge semiconductor device and electronic component manufacturing systems globally. Over time, we have evolved into a leading global corporation with state-of-the-art technological capabilities and a widespread international presence. Our commitment to growth prioritizes “thin-film technology” as our core expertise.
Date
May 5, 2026
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May 7, 2026
Location
MITEC, Kuala Lumpur, Malaysia
Date
May 18, 2026
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May 21, 2026
Location
Portland Marriott Downtown Waterfront, Oregon
Virginia Commonwealth University EMBA Students Visit Samco for Global Business and Kyoto Management Insights
VCU EMBA students visited Samco in Kyoto, exploring its history, semiconductor manufacturing processes, and unique Kyoto approach to business and…
IMiF Expands GaN Research Capability for Power Devices with Samco ICP-RIE Platform
Samco systems support IMiF’s GaN pilot line, enabling precise AlGaN/GaN etching and advancing wide bandgap semiconductor research in Europe.
Stable Device Isolation Processing for 6-Inch GaN-Based Power Devices
GaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.
DTU Selects Samco Plasma Etching System for Quantum Photonics Research
The Technical University of Denmark selects Samco’s RIE-400iP plasma etching system for quantum photonics research, enabling precise III-V processing for…
Innovation Center of NanoMedicine (iCONM): Professor Kazunori Kataoka
Professor Kazunori Kataoka presents nanomachine-based drug delivery and the vision of “in-body hospitals” at the 2025 Samco Foundation lecture.
Samco Strengthens Strategic Collaboration with ITRI Taiwan
Samco expands partnership with ITRI Taiwan, focusing on semiconductor processing, silicon photonics, and chiplet integration through joint R&D efforts.
Chairman Osamu Tsuji Awarded Honorary Doctorate by Kyoto Institute of Technology
Samco Chairman Osamu Tsuji received an Honorary Doctorate from Kyoto Institute of Technology in recognition of his contributions to education…
Atomic Layer Etching Control – Intro to ALE Systems
Introducing Samco’s Atomic Layer Etching (ALE) systems, detailing precise low-bias control and fast gas switching for uniform, low-damage etching processes.
Research Focused Systems
Featured Solutions
Gallium Nitride (GaN) Etching
GaN is a III-V compound semiconductor material which has wide band gap and high electron mobility. Applications include Vertical Power Devices, HB LEDs, and more.
Indium Phosphide (InP) Etching
InP is a compound semiconductor material of III-V group. This material has a wide band gap and a high electron mobility.
Gallium Arsenide (GaAs) Etching
GaAs is a III–V compound direct-gap semiconductor used for applications including optoelectronics and radio-frequency (RF) devices.
Atomic Layer Etching (ALE)
ALE enables atomic-scale precision for controlled material removal, ensuring uniformity and selectivity in advanced semiconductor fabrication.
SiO2 deposition
SiO2 properties include excellent abrasion resistance, good electrical insulation, low thermal expansion and high thermal stability, making it ideal for a wide range of applications.
SiNx deposition
SiNx properties include low moisture and oxygen permeation, good electrical insulation and low thermal expansion. This material is used in a variety of applications in device fabrication.
Silicon Deep Reactive Ion Etching (DRIE)
The Bosch Process enables deep silicon etching process solutions with high aspect ratio etching and excellent selectivity, ideal for MEMS and packaging applications.
Atomic Layer Deposition (ALD)
ALD delivers uniform, pinhole-free films with precise thickness control, making it ideal for high-aspect-ratio and complex device structures.
We deliver cutting-edge process equipment designed for precise film deposition, high-performance etching, and efficient surface cleaning. Our solutions cater to both R&D and production needs across diverse applications, including compound semiconductors, quantum computing, optoelectronics, MEMS, microfluidics, power devices, RF devices, and more.
