Category: NEWS Archive
SAMCO is proud to announce the release of our newest deep silicon etching system — the RIE-800iPBC — for MEMS and TSV production processing. The RIE-800iPBC is the latest in SAMCO’s etching system lineup, and was officially introduced by SAMCO at SEMICON Japan 2013 (the world’s largest exhibition for semiconductor equipment and materials), held in Tokyo from December 4-6, 2013.
SAMCO released a new cassette-to-cassette production etch system, the model RIE-600iPC, for Silicon Carbide (SiC) processing. The main system applications are planar processing for SiC power devices, fine trench etching for SiC MOS structures, SiC through-wafer etching for via hole formation, and SiO2 mask etching.
Tokyo, Japan July 24, 2013 – SAMCO Inc. (Located at 36 Waraya-cho, Takeda, Fushimi-ku, Kyoto – Second Section of the TSE: 6387) announced today that SAMCO’s stock listing was transferred from TSE JASDAQ (Standard) to the Second Section of the Tokyo Stock Exchange market (TSE). SAMCO is the first transfer of its listing since the consolidation of the Tokyo Stock Exchange (TSE) and the Osaka Securities Exchange (OSE) on July 16, 2013.
The RIE-600iP – SAMCO’s latest ICP etching solution designed specifically for SiC power devices fabrication – was recently honored with the “Semiconductor of the Year” award given by The Semiconductor Industry News. On June 5th, the award was presented at a ceremony at the JPCA Show 2013 (hosted by Tokyo Big Sight).
In accordance with the “Basic Guidelines for Reconstruction in Response to the Great East Japan Earthquake” (determined on July 29, 2011) and the “Basic Policy for Recovery and Reconstruction of Fukushima” (passed on July 13, 2012), the FUTURE-PV (Fukushima Top-Level United Center for Renewable Energy Research-Photo Voltaic Innovation) Research Facility has been established in Fukushima Prefecture as a 5-year project from 2012 to 2016. The research at this facility will be supervised by Professor Makoto Konagai of the Department of Physical Electronics, Graduate School of Science and Engineering, Tokyo Institute of Technology.
Smartphones and tablets are now taking the spotlight, together with rise of non-smart mobile phones in many developing countries. In light of this advance, there has been a sudden upsurge in demand for electronic parts such as SAW (Surface Acoustic Wave) filters that are used in mobile phones and tablets.
On December 1, 2012, SAMCO released its newest plasma etching system – the RIE-600iP. Specifically designed for SiC etching, the RIE-600iP is the latest in a series of plasma etching systems optimized for compound semiconductors. “Next-generation power devices” are expected to contribute to energy conservation and become one of the key technologies in green electronics. SAMCO is confident that the RIE-600iP, and the rise of SiC-based “next-generation power devices”, will contribute to a greener environment.
In light of the recent devastation to the United States’ eastern seaboard caused by Hurricane Sandy, we at SAMCO would like to convey our sympathy to those affected by this storm. With over 25 years of presence in the United States, SAMCO has presented a donation to the American Red Cross, to support the recovery and restoration efforts in the affected areas. We express our condolences to all of the individuals and families who were affected by Hurricane Sandy, as well as our best wishes for a smooth recovery.