Process Solutions for Laser Diode Manufacturing
SAMCO Inc. > Markets > Process Solutions for Laser Diode Manufacturing
1. GaN/AlGaN/InGaN Epi Growth
![GaN/AlGaN/InGaN Epi Growth](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-01-01.gif?fit=350%2C404&ssl=1)
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
2. Ridge Formation with End Point Monitoring
![Ridge Formation with End Point Monitoring](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-02.gif?fit=350%2C404&ssl=1)
![End Point Detection](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2015/11/EPD-2.jpg?fit=350%2C350&ssl=1)
Samco ICP etch systems are equipped with optional optical or interferometric endpoint monitor. The endpoint monitor enables precise etch depth control, combined with specially developed low-speed etch process.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
3. Photoresist Removal
![Photoresist Ashing](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-03.gif?fit=350%2C404&ssl=1)
![Plasma Cleaner for SAW Device Manufacturing](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Plasma-Cleaner-for-SAW-Device-Manufacturing.jpg?fit=350%2C350&ssl=1)
![UV-Ozone System for Photoresist Ashing](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/UV-Ozone-System.jpg?fit=350%2C350&ssl=1)
Samco holds multiple system lineup (plasma cleaners and UV-Ozone cleaners) for photoresist stripping to meet customers’ demands.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
4. Passivation Film Deposition by PECVD
![Passivation Film Deposition by PECVD](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-04.gif?fit=350%2C404&ssl=1)
![Stress Control of SiH4-SiO2](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/01/Stress-Control-of-SiH4-SiO2.jpg?fit=350%2C350&ssl=1)
SiH4 Flow Rate v.s. Film Stress
![Uniformity and Deposition Rate of SiH4-SiO2](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/01/Uniformity-and-Deposition-Rate-of-SiH4-SiO2.jpg?fit=350%2C350&ssl=1)
SiH4 Flow Rate v.s. Uniformity/Deposition Rate
SiO2 film properties are highly controllable with experienced process recipes.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
5. Exposure of p-Contact Layer (SiO2 Etching)
![Exposure of p-Contact Layer (SiO2 Etching)](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-05.gif?fit=350%2C404&ssl=1)
![Atmospheric Cassette RIE Systems](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/atmospheric-cassette-RIE-systems.jpg?fit=350%2C350&ssl=1)
![SiO2 Etching for Contact Hole Formation](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/SiO2-etching-for-contact-hole-formation.jpg?fit=350%2C350&ssl=1)
Samco’s atmospheric cassette RIE etchers equipped with double cassettes and multi-joint robot for wafer transfer improve throughput of SiO2 etching for contact hole formation. The systems show stable SiO2 etch uniformity around ± 1.5% over 25 x ø4”wafers.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
7. p-Electrode Formation by Sputtering
![p-Electrode Formation by Sputtering](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-process-flow-7.jpg?fit=350%2C350&ssl=1)
Creating p-electrode by sputtering Palladium (Pd) and Platinum (Pt).
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
8. Wafer Polishing
![Substrate Polishing](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-process-flow-8.jpg?fit=350%2C350&ssl=1)
Polish away GaN substrate from the wafer backside to be 100 µm thick.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
9. n-Electrode Formation by Sputtering
![n-Electrode Formation](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-process-flow-9.jpg?fit=350%2C350&ssl=1)
Sputter Titanium (Ti), Platinum (Pt), and Gold (Au) subsequently to create n-electrode.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
10. Wafer Dicing
![Wafer Dicing for Laser Diode Fabrication](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-06.gif?fit=350%2C350&ssl=1)
![Plasma Dicing](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Plasma-Dicing.jpg?fit=350%2C350&ssl=1)
Samco provides plasma scribing processes for compound semiconductor materials. Fragile and small samples can be handled using a wafer carrier and a reliable transfer robot.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
11. Reflective Layer Formation (SiO2 or SiNx deposition by PECVD)
![Reflective Layer Formation (SiO2 or SiNx deposition by PECVD)](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode-Process-07.gif?fit=350%2C350&ssl=1)
![Advanced Innerwall](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Innerwall-Cartoon.gif?fit=350%2C350&ssl=1)
One of unique system features of Samco anode PECVD systems is Advanced Innerwall. Protective shield inside the reaction chamber will control disposal of the plasma discharge and improve deposition uniformity.
![Arrow](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/02/Arrow.jpg?fit=50%2C92&ssl=1)
12. Surface Cleaning before Packaging
![Laser Diode](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Laser-Diode.jpg?fit=350%2C350&ssl=1)
![Bench-top Plasma Cleaner](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2015/12/PC-1100-Chamber.jpg?fit=350%2C350&ssl=1)
![tabletop plasma cleaner](https://i0.wp.com/www.samcointl.com/opto/wp-content/uploads/2016/03/Plasma-Cleaner-Shelves.jpg?fit=350%2C350&ssl=1)
Samco’s plasma cleaners can process multiple wafers in one time with optional shelves.