Samco system lineup of plasma cleaners covers both R&D and device production customers.
Our tabletop plasma cleaners have small footprint and are capable of batch processing of samples/wafers using multiple shelves.
Our large-chamber or magazine-to-magazine plasma cleaners are suitable for back-end cleaning process in device fabrication.
Tabletop Plasma Cleaners
The PC-300 and PC-1100 are tabletop plasma cleaning systems using parallel-plate direct plasma. The systems can be configured in three different processing modes (Reactive Ion Etch (RIE), plasma, and downstream) that enable the user to select the optimum processing environment.
The systems can be used to clean organic and inorganic contamination from the surface of samples such as plastic packages, LCD substrates, multi-chip modules and hybrid ICs. Other applications include photoresist ashing, ink removal, surface activation and wettability improvement.
The PC-300 and PC-1100 are fully automatic systems with a touch panel. The process chamber enables the user to install multiple sample shelves, and the high degree of flexibility in configuration supports batch processing of a wide degree of products from small electronic components to larger substrates.
High Volume Plasma Cleaners
Samco offers large-chamber plasma cleaners as well as laboratory plasma cleaners. The large plasma cleaning systems can accommodate large substrates, and they are capable of batch plasma treatment of small samples.
The PC-5000 offers larger substrate electrodes for batch or single substrate processing of large size substrates up to 610 mm.
The PXA-100 and PX-200 are fully automatic magazine-to magazine plasma systems that are ideal for the reliability enhancement of surface mount packaging processes. The magazine stacker enables the user to load 2 columns of magazines.
Plasma Surface Modification and Activation
Samco plasma cleaners are suitable for plasma surface modification. Various materials such as silicon, glass, metals and polymers can be processed for wettability control. Polymethyl methacrylate (PMMA) samples were processed using a plasma cleaner and characterized with water contact angle. The samples showed hydrophilic surface after the plasma processing. This surface modification process enhances adhesion of materials, and some customers use this process for bonding of samples in microfluidic device fabrication. Typical material combination of this application is “glass and glass” or “Polydimethyl siloxane (PDMS) and glass”. Plasma surface activation enables low-temperature bonding and integration of heat-sensitive materials for various applications.
Do you need plasma treatment of non-flat samples? We’ve got you covered!
We offer plasma cleaning process solutions for inner-walls of 3D structures such as plastic and glass tubes.
Contact Angle : 76.8°
PMMA after Plasma Surface Modification
Contact Angle : 20.2°
The surface of a polymer material was roughened using plasma treatment. Using this process, surface area of the sample was dramatically increased.
After Plasma Treatment
|Tabletop Plasma Cleaners||High Volume Plasma Cleaners|
|Loading||Manual Load||Manual Load
|Sample Size||320 mm x 230 mm
405 mm x 410 mm (powered)
350 mm x 425 mm (grounded)
|Max. 500 mm x 500 mm
Max. 80 mm x 250 mm
|Gases||Up to 3 gas lines||Up to 4 gas lines|
|Plasma Mode||Three Plasma Processing Modes||Direct Plasma|
|RF Power||600/1000 W||600/1000/3000 W|
|System Control||Easy-to-use Touch-panel GUI|
|System Features||• Multiple shelves for batch processing||• Batch processing of small substrates
• Optional magazine stacker
• Surface cleaning of plastic packages and lead-frames
• Precision cleaning of optical components and molds
• Surface cleaning of organic films
• Ashing of photoresist
• Removal of organic contaminants
Three plasma processing modes
Samco’s bench-top plasma cleaners are equipped with three different modes depending on shelf position settings in order to provide plasma treatment process options.
Reactive Ion Etching (RIE) Mode
Samples are placed on the powered electrode. Ions induced by RF power directly attacks the substrate, and they will increase the etch rate.
Plasma Etching (PE) Mode
Samples are placed on grounded electrode. While ions do not attack the substrate, radicals react with the surface. This configuration eliminates the risks of plasma damage caused by ion bombardment.
A perforated electrode is placed above samples to isolate them from the plasma and minimize plasma damage.
Multiple shelves allow for increased throughput
Magazine stacker enables the user to load 2 columns of magazines