ICP Plasma Etching Systems (ICP-RIE)

SAMCO Inc. > Etching Systems > ICP Etch Systems

Samco offers multiple ICP plasma etching (ICP-RIE) systems to meet each customer’s process needs for plasma etching.
Our ICP plasma etching systems are able to process various types of materials (silicon, dielectrics, III-V compound semiconductor, metals, polymer, resist and more) from small samples/wafers to 300 mm.

Open-load ICP Etch Systems

Open-load ICP Etch System

The ICP plasma etcher, RIE-10iP is an open load Inductively Coupled Plasma (ICP) etching system for fluorine based chemistry. In this configuration the samples are loaded directly onto a fluid cooled electrode.

The system features:

  • A computerized touch panel that provides a user-friendly interface for parameter control, and recipe storage.
  • Fully automatic “one-button” operation or full manual override.
  • A symmetrical evacuation design coupled to a turbo molecular pump creates an efficient vacuum flow. A close coupled Gas delivery box reduces the residence time due to a long gas delivery pipes.
  • 1 KW Tornado ICP
  • Mechanical clamp with helium backside cooling

Load-lock ICP Etch Systems

Load-lock ICP Etch System

A Load lock system has a reaction chamber, and a separate loading chamber. The addition of a loadlock allows the reaction chamber to stay under vacuum. The controlled environment improves process repeatability. Load lock systems are also typically required when using corrosive or toxic gases such as Chlorine, and when the etch by-products are harmful.

The RIE-200iP, RIE-330iP, RIE-400iP and RIE-600iP are high precision Inductively Coupled Plasma etching systems that can be used to etch all types of semiconducting, insulating and metallic films. They include all the features of the open-load ICP, and can be customized with additional options that are required for etching specific materials.

Atmospheric Cassette ICP Etch Systems

Atmospheric Cassette ICP-RIE Etcher

For Fluorine or organic based chemistries the addition of an atmospheric cassette to a reaction chamber may be the ideal solution to increase throughput. The RIE-100iPC is an Inductively Coupled Plasma etch system that includes a single or dual cassette coupled to an atmospheric robot and wafer aligner. The robot has vacuum suction that allows for high speed wafer transfer, and the alignment station guarantees loading accuracy.

In this configuration the reaction chamber is rapidly vented to unload, and then load a new wafer.  After the reaction chamber slit valve closes, the chamber is pumped to process pressure, and after the process completes, the cycle is repeated.

The RIE-100iPC includes all the features of the open-load platform. An optional e-chuck increases heat transfer from the substrate during processing.

Vacuum Cassette ICP Etch Systems

Vacuum Cassette ICP-RIE Plasma Etching Systems

Vacuum Cassette systems are typically used when processes require a controlled environment,  corrosive/ toxic gases such as Chlorine are being used,  or when the etch by-products are harmful.  In this configuration the Reaction chamber is coupled to a transfer chamber with vacuum robot, and an additional Loading chamber includes a vacuum cassette elevator.

The RIE-200iPC, RIE-330iPC and RIE-600iPC are cassette based high precision Inductively Coupled Plasma etching systems that can be used to etch all types of semiconducting, insulating and metallic films. They include all the features of the open-load ICP, and have additional options that are required for etching specific materials.

Process Examples

SAMCO ICP etch systems provide repeatable dry etching solutions of a wide variety of materials including

  1. Silicon
  2. Dielectrics – SiO(Quartz), SiNx, High-K and Low-K
  3. Compound Semiconductors – GaN, GaAs, InP, SiC and More
  4. Metals – Aluminum, Titanium, Moly and Metal Alloys
  5. Polymer and Photoresist – Polyimide, Parylene, SU-8 and More
  6. Other Materials – Sapphire, Diamond, LiNbO3, LiTaO3, PZT, ITO, AlN and More

The systems and processes are applicable to both R&D and production. Please check our Process Data Page for our dry etch process capabilities.

InP Anisotropic Etching for Waveguide Fabrication

Anisotropic InP etching for waveguide fabrication

AlGaAs Etching for VCSEL

Anisotropic AlGaAs etching for VCSEL fabrication

GaAs Plasma Dicing

Die singulation of GaAs substrate

Specification Chart

Open-load ICP Etch Systems Load-lock ICP Etch Systems Atmospheric Cassette ICP Etch Systems Vacuum Cassette ICP Etch Systems
Loading Open-Load Load-lock Single/Double Cassette Loading Vacuum Cassette Loading
Wafer Placement Manual Linear Robot Atmospheric Robot Vacuum Robot
Sample Size 100/150 mm 100/200/350 mm 100/200 mm 200/350 mm
Chuck Type Manual Clamp Fluid Cooled/Mechanical Clamp/E-Chuck Fluid Cooled/E-Chuck Fluid Cooled/Mechanical Clamp/E-Chuck
Pumping Type Symmetrical Pumping Symmetrical or Axial Pumping Symmetrical Pumping Symmetrical or Axial Pumping
Vacuum System Turbo Pump with Rotary Backing Pump
Gases Up to 6 gas lines Up to 8 gas lines
ICP Power 1 KW
Tornado ICP Coil
1 KW
Tornado ICP Coil
1 KW
Cone-shape ICP Coil
3 KW
Planar ICP Coil
or
3 KW
SSTC Coil
1 KW
Tornado ICP Coil
1 KW
Tornado ICP Coil
3 KW
Planar ICP Coil
or
3 KW
SSTC Coil
Bias Power 300 W 300/600/1 KW
Chuck Temperature Range 20~25°C -10~250°C
System Control Easy-to-use Touch-panel GUI
Endpoint Option Optical/Interferometric End-point Detection
Applications • Dry etching of various materials using Fluorine chemistry

• Dry etching of organics

• Failure Analysis

• Dry etching of various materials using Fluorine chemistry

• Dry etching of organics

• Failure Analysis

• Dry etching of various materials using Chlorine chemistry

• Dry etching of various materials using Fluorine chemistry

• Dry etching of organics

• Failure Analysis

• Dry etching of various materials using Fluorine chemistry

• Dry etching of organics

• Failure Analysis

• Dry etching of various materials using Chlorine chemistry

System Features

 Unique Tornado Coil

Tornado ICP Coil

The three dimensional coil generates high ion density and enables high-uniformity plasma etching over the wafers for nano-scale structure fabrication.

 Planar ICP Coil

Planar ICP Coil

Generates high-density plasma, and suitable for high-rate plasma etching with high RF power.

 Cone-shape ICP Coil

ICP Coil for Fine Etching

Capable of stable plasma discharge at lower pressures, and allowing low-damage plasma etching at low temperatures to achieve reliable and repeatable ICP-RIE processes.

 Symmetrically Shielded
Tornado Coil (SSTC)

Symmetrically Shielded Tornado Coil

Auto-matching unit works as a RF power divider to inner and outer coil, and enables high etch uniformity over a large area.

 Height-adjustable
Electrode

Height Adjustable Electrode

Height-adjustable lower electrode (air operated) enables optimization of the distance between the wafer and ICP plasma source to achieve uniform plasma etching over the wafer.

 Symmetrical
Evacuation Design

Symmetrical Evacuation Design for High Uniformity

Improves etch uniformity over the wafers and process repeatability.

  • SAMCO ICP Etch System for R&D

Testimonial

 SAMCO ICP etch systems are mostly used for processing of compound semiconductors including GaAs, GaN and SiC for various researches.
Due to capabilities of system customization and excellent process recipes, the systems are appreciated by various renowned customers including

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.
Top